Atomic diffusion properties in wire bonding

Transactions of Nonferrous Metals Society of China (English Edition)

Volumn 16, Issue 2, 2006, Pages 463-466

  Li, Jun Hui ^a   Wang, Fu Liang ^a   Han, Lei ^a   Duan, Ji An ^a   Zhong, Jue ^a  

^a CENTRAL SOUTH UNIVERSITY   (China)

Author keywords

Atomic diffusion; Bonding strength; Dimples; Thermosonic bond

Indexed keywords

ATOMS; BOND STRENGTH (MATERIALS); GRINDING (MACHINING); INTERFACES (MATERIALS); PUNCHING; ROLL BONDING; SCANNING ELECTRON MICROSCOPY; TENSILE STRENGTH; TRANSMISSION ELECTRON MICROSCOPY; ULTRASONIC EFFECTS;

ATOMIC DIFFUSION; BONDING POINT; BONDING STRENGTH; DIMPLES; TENSILE FRACTURE; THERMOSONIC BOND;

WIRE DRAWING;

EID: 33745650101     PISSN: 10036326     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1003-6326(06)60079-4     Document Type: Article

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