Power and interface features of thermosonic flip-chip bonding

IEEE Transactions on Advanced Packaging

Volumn 31, Issue 3, 2008, Pages 442-446

  Li, Junhui ^a   Han, Lei ^a   Zhong, Jue ^a  

^a CENTRAL SOUTH UNIVERSITY   (China)

Author keywords

Dislocation; Input power; Reflow bonding; Thermosonic flip chip; Vibration

Indexed keywords

DISLOCATION; INPUT POWER; REFLOW BONDING; THERMOSONIC FLIP-CHIP; VIBRATION;

CATHODE RAY OSCILLOSCOPES; DIFFUSION; DIGITAL STORAGE; DISLOCATIONS (CRYSTALS); SMELTING; TRANSMISSION ELECTRON MICROSCOPY; ULTRASONICS;

FLIP CHIP DEVICES;

EID: 65349106729     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2008.927828     Document Type: Article

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