Wire bonding dynamics monitoring by wavelet analysis

Sensors and Actuators, A: Physical

Volumn 137, Issue 1, 2007, Pages 41-50

  Han, Lei ^a   Gao, Rongzhi ^a   Zhong, Jue ^a   Li, Hanxiong ^b  

^a CENTRAL SOUTH UNIVERSITY   (China)

^b CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

Statistics based data processing; Transducer; Ultrasonic bonding; Wavelet analysis

Indexed keywords

ALUMINUM; BONDING; DATA PROCESSING; PIEZOELECTRIC TRANSDUCERS; STATISTICAL METHODS; ULTRASONIC WAVES; VIBRATIONS (MECHANICAL); WAVELET ANALYSIS;

BONDING TARGET; STATISTICS BASED DATA PROCESSING; ULTRASONIC BONDING;

GRANULAR MATERIALS;

EID: 34249328091     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2007.02.041     Document Type: Article

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