Bondability window and power input for wire bonding

Microelectronics Reliability

Volumn 46, Issue 2-4, 2006, Pages 610-615

  Han, Lei ^a   Wang, Fuliang ^a   Xu, Wenhu ^a   Zhong, Jue ^a  

^a CENTRAL SOUTH UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; ELECTRIC POTENTIAL; LOADING; OSCILLATIONS; TRANSDUCERS;

BONDABILITY WINDOW; POWER INPUT; PZT/TRANSDUCER SYSTEM; WIRE BONDING;

WIRE;

EID: 30844456627     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2005.05.018     Document Type: Article

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