Electrodeposition of CoMoP thin film as diffusion barrier layer for ULSI applications

Surface and Coatings Technology

Volumn 203, Issue 24, 2009, Pages 3692-3700

  Hamid, Z Abdel ^a   Aal, A Abdel ^a   Shaaban, Ali ^a   Hassan, H B ^b  

^a CENTRAL METALLURGICAL RESEARCH AND DEVELOPMENT INSTITUTE CMRDI   (Egypt)

^b CAIRO UNIVERSITY   (Egypt)

Author keywords

Barrier layers; Capping layers; Corrosion; Electrodepostion CoMoP; Ferromagnetic; Thin films

Indexed keywords

3.5%NACL; AMORPHOUS STRUCTURES; AS-DEPOSITED FILMS; BARRIER LAYERS; CAPPING LAYERS; CHEMICAL COMPOSITIONS; CODEPOSITION; COPPER INTERCONNECT; CURRENT EFFICIENCY; DEPOSITED LAYER; DEPOSITION CURRENT DENSITY; DEPOSITION TEMPERATURES; DIFFUSION BARRIER LAYERS; ELECTRICAL RESISTANCES; ELECTRODEPOSITION TECHNIQUE; ELECTRODEPOSTION COMOP; ENERGY DISPERSIVE X-RAY; FERROMAGNETIC; HYSTERESIS LOOP MEASUREMENTS; METAL CAPPING LAYERS; OPTIMUM PH; OXIDATION PROPERTIES; PH VALUE; PLATING BATH; PLATING PROCESS; PLATING RATES; PLATING SOLUTIONS; POLARIZATION BEHAVIOR; POLARIZATION STUDY; POLYCRYSTALLINE STRUCTURE; SEM; SOLUTION PH;

CHRONOAMPEROMETRY; COATED MATERIALS; COPPER; CYCLIC VOLTAMMETRY; DIFFUSION BARRIERS; ELECTROCHEMICAL CORROSION; ELECTROPLATING; FERROMAGNETIC MATERIALS; FERROMAGNETISM; FILM GROWTH; HYSTERESIS; MOLYBDENUM; OPTICAL INTERCONNECTS; OXIDATION; PH; POLARIZATION; SCANNING ELECTRON MICROSCOPY; SODIUM CHLORIDE; THIN FILMS;

AMORPHOUS FILMS;

EID: 67649859265     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2009.06.004     Document Type: Article

References (46)

1. Paunovic M., and Schlesinger M. Fundamentals of Electrochemical Deposition (1998), John Wiley & Sons, Inc., New York 157
2. Nicolet M.A. Thin Solid Films 52 (1978) 415
3. Cotton A.F., and Wilkinson G. Advanced Inorganic Chemistry. 5th ed. (1988), John Wiley & Sons, Inc., New York 686
4. Gómez E., Pellicer E., and Vallés E. J. Appl. Electrochem. 33 (2003) 245
5. Taylor W.P., Schneider M., Baltes H., and Allen M.G. Proceedings of the International Conference on Solid-State Sensors and Actuators, Transducers '97, Chicago (1997)
6. Subramanian P.R., and Laughlin D.E. Bull. Alloy Phase Diagr. 11 (1990) 169
7. He Y., and Fen J.Y. J. Cryst. Growth 263 (2004) 203
8. Kuo Y.L., Lee H.H., Lee C., Lin J.C., Shue S.L., Liang M.S., and Dianiels B.J. Electrochem. Solid-State Lett. 7 (2004) C35
9. Kuo Y.L., Lee C., Lin J.C., Yen Y.W., and Lee W.H. Thin Solid Films 484 (2005) 265
10. Vanasupa L., Joo Y.C., Besser P.R., and Pramanick S. J. Appl. Phys. 85 (1999) 2583
11. Oksam G., Vereecken P.M., and Searson P.C. J. Electrochem. Soc. 146 (1999) 1436
12. Dubin V.M., Shacham-Diamand Y., Zhao B., Vasudev P.K., and Ting C.H. J. Electrochem. Soc. 144 (1997) 898
13. In: Yoshino K., Paunovic M., Ohno I., and Migoshi Y. (Eds). PV 93-26, The Electrochemical Society Proceedings Series, Pennington, NJ (1993) 370
14. Abdel Aal A., Barakat H., and Abdel Hamid Z. Surf. Coat. Technol. 202 (2008) 4591
15. Abdel Aal A., Shaaban A., and Abdel Hamid Z. Appl. Surf. Sci. 254 (2008) 1966
16. Sun Y. Semicond. Sci. Technol. 11 (1996) 805
17. Dulal S.M.S.I., and Charles E.A. J. Alloys Compd. 455 (2008) 274
18. Petrov N., Sverdlov Y., and Shacham-Diamand Y. J. Electrochem. Soc. 149 (2002) 187
19. Dulal S.M.S.I., Charles E.A., and Roy S. J. Appl. Electrochem. 34 (2004) 151
20. Wu Y., Wan C.C., and Wang Y.Y. J. Electron. Mater. 34 (2005) 541
21. Koiwa I., Usudo M., Yamada K., and Osaka T. J. Electrochem. Soc. 135 (1988) 718
22. Ivanova N., Ivanov S., Boldyrev E., and Stadnik O. ISSN 0033 1732. Prot. Met. 42 (2006) 354
23. Saifullin R., Fomina R., Mingazova G., and Khaidarov R. Prot. Met. 38 (2002) 471
24. Hansen M. Constitution of Binary Alloys (1958), Mc Graw Hill, New York
25. Sverdlov Y., Bogush V., and Shacham-Diamand Y. Microelectron. Eng. 83 (2006) 2243
26. Shacham-Diamand Y., Sverdlov Y., Bogush V., and Ofek-Almog R. J. Solid State Electrochem. 11 (2007) 929
27. Chopra K.I. Thin Film Phenomena (1969), McGraw-Hill, New York
28. Tarozaite R., Stalnionis G., Sudavicius A., and Kurtinaitiene M. Surf. Coat. Technol. 138 (2001) 61
29. Sankara Narayanan T.S.N., Selvakumar S., and Stephen A. Surf. Coat. Technol. 172 (2003) 298
30. Matsubara H., and Yamada A. J. Electrochem. Soc. 141 (1994) 2386
31. García-Arribas A., Barandiarán J.M., and Herreros y.J. J. Magn. Magn. Mater. 131 (1994) 129
32. Xiao J.Q., Chien C.L., and Gavrin A. J. Appl. Phys. 79 (1996) 5309
33. Gómez E., Pellicer E., Alcobe X., and Vallés E. J. Solid State Electrochem. 8 (2004) 497
34. Stern M., and Geary A.L. J. Electrochem. Soc. 104 (1957) 56
35. Mansfeld F. J. Electrochem. Soc. 120 (1973) 515
36. Clayton C.R., and Lu Y.C. Corros. Sci. 29 (1989) 881
37. Ameer M.A., Fekry A.M., and El-Taib Heakal F. Electrochim. Acta 50 (2004) 43
38. Boucherit N., Hugot-le Goff A., and Joiret S. Corrosion 48 (1992) 569
39. Tobler W.J., and Virtanen S. Corros. Sci. 48 (2006) 1585
40. Bastidas J.M., Torres C.L., Cano E., and Polo J.L. Corros. Sci. 44 (2002) 625
41. Sakashita M., and Sato N. In: Frenkental K. (Ed). Passivity of Metals (1978), The Electrochem. Soc., Pennington 479
42. Clayton C.R., and Lu Y.C. J. Electrochem. Soc. 133 (1986) 2465
43. Robertson W.D. J. Electrochem. Soc. 98 (1951) 94
44. Lu Y.C., Clayton C.R., and Brooks R. Corros. Sci. 29 (1989) 863
45. Ogura K., and Ohama T. Corrosion 40 (1984) 47
46. Sriraman K.R., Ganesh Sundara Raman S., and Seshadri S.K. Mater. Sci. Eng. A 460-461 (2007) 39