Copper electroplating from vanadate- and molybdate-containing electrolytes with suspended titanium dioxide

Protection of Metals

Volumn 38, Issue 5, 2002, Pages 471-474

  Saifullin, R S ^a   Fomina, R E ^a   Mingazova, G G ^b   Khaidarov, R A ^c  

^a KAZAN NATIONAL RESEARCH TECHNOLOGICAL UNIVERSITY   (Russian Federation)

^b Institute of Ecology and Subsoil Use of Tatars Tan Academy of Sciences   (Russian Federation)

^c Ctrl Res Inst Geol NM   (Russian Federation)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; DEPOSITION; ELECTROLYTES; HEAT RESISTANCE; IONS; MOLYBDENUM COMPOUNDS; OXIDATION; PH EFFECTS; TITANIUM DIOXIDE; VANADIUM COMPOUNDS;

DISPERSED PHASE;

ELECTROPLATING;

EID: 0141575463     PISSN: 00331732     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1020355030961     Document Type: Article

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