Material properties and intermetallic compounds of Sn3wt%Ag0.5wt%Cu0. 019wt%Ce (SACC)

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 211-218

  Lau, John H ^a   Pang, John H L ^b   Lee, Ning Cheng ^c   Xu, Luhua ^b  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^c INDIUM CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ORGANIC SOLDERABILITY PRESERVATIVES; SURFACE FINISHES;

CERIUM; COPPER OXIDES; DOPING (ADDITIVES); ELASTIC MODULI; STRAIN RATE; TIN COMPOUNDS;

INTERMETALLICS;

EID: 35348817934     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373800     Document Type: Conference Paper

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