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Volumn 455-456, Issue , 2004, Pages 307-311
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Effect of the Bi content on the mechanical properties of a Sn-Zn-Al-Bi solder alloy
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Author keywords
Fracture; Lead free solder; Mechanical properties; Microstructure; Welding
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Indexed keywords
ENERGY DISPERSIVE SPECTROSCOPY;
FRACTURE;
HARDNESS;
MICROSTRUCTURE;
SCANNING ELECTRON MICROSCOPY;
SOLDERING ALLOYS;
TENSILE STRENGTH;
WELDING;
HOMOGENIZED MICROSTRUCTURES;
LEAD FREE SOLDERS;
XRF SPECTROMETRY;
MATERIALS SCIENCE;
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EID: 17044442479
PISSN: 02555476
EISSN: 16629752
Source Type: Book Series
DOI: 10.4028/www.scientific.net/msf.455-456.307 Document Type: Conference Paper |
Times cited : (4)
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References (9)
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