Self-assembled nanogaps for molecular electronics

Nanotechnology

Volumn 20, Issue 24, 2009, Pages

  Tang, Qingxin ^a   Tong, Yanhong ^a   Jain, Titoo ^a   Hassenkam, Tue ^a   Wan, Qing ^b   Moth Poulsen, Kasper ^a   Bjørnholm, Thomas ^a  

^a UNIVERSITY OF COPENHAGEN   (Denmark)

^b HUNAN UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPES; CONDUCTANCE MEASUREMENT; COVALENTLY BONDED; ELECTRICAL MEASUREMENT; EXTERNAL CIRCUITS; GAP LENGTH; GOLD NANOPARTICLES; GOLD NANOROD; MOLECULAR DEVICE; NANO-GAP; NANOGAPS; OLIGOPHENYLENEVINYLENES; RIGID MOLECULES; SCREENING EFFECT; SELF-ASSEMBLED;

ELECTRIC WIRE; MOLECULAR ELECTRONICS; MOLECULES; NANOPARTICLES; NANORODS; NANOWIRES; PLASMONS; SELF ASSEMBLY;

GOLD;

ANTIMONY; GOLD NANOPARTICLE; NANOROD; NANOWIRE; THIOL DERIVATIVE; TIN OXIDE; GOLD; NANOMATERIAL; TIN DERIVATIVE; TIN DIOXIDE;

ARTICLE; ATOMIC FORCE MICROSCOPY; CHEMICAL ANALYSIS; CONTROLLED STUDY; ELECTRIC CONDUCTIVITY; ELECTRODE; FEASIBILITY STUDY; MATERIAL COATING; METAL BINDING; MOLECULAR ELECTRONICS; MOLECULAR SIZE; NANODEVICE; NANOFABRICATION; PRIORITY JOURNAL; SYNTHESIS; CHEMISTRY; CONFORMATION; CRYSTALLIZATION; ELECTRONICS; EQUIPMENT; EQUIPMENT DESIGN; EVALUATION; INSTRUMENTATION; MACROMOLECULE; MATERIALS TESTING; METHODOLOGY; MICROELECTRODE; NANOTECHNOLOGY; PARTICLE SIZE; SURFACE PROPERTY; ULTRASTRUCTURE;

CRYSTALLIZATION; ELECTRIC CONDUCTIVITY; ELECTRONICS; EQUIPMENT DESIGN; EQUIPMENT FAILURE ANALYSIS; GOLD; MACROMOLECULAR SUBSTANCES; MATERIALS TESTING; MICROELECTRODES; MOLECULAR CONFORMATION; NANOSTRUCTURES; NANOTECHNOLOGY; PARTICLE SIZE; SURFACE PROPERTIES; TIN COMPOUNDS;

EID: 67649235472     PISSN: 09574484     EISSN: 13616528     Source Type: Journal    
DOI: 10.1088/0957-4484/20/24/245205     Document Type: Article

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