Ultrasonic joining of SiaN4 plates at 19 kHz using Al, Cu and Ni plates as insert metal

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 38, Issue 10, 1999, Pages 6166-6169

  Okamura, Naoyuki ^a   Watanabe, Yuji ^a  

^a TAKUSHOKU UNIVERSITY   (Japan)

Author keywords

Joining by insert metal; Joining of ceramic plates; Joining of silicon nitride; Ultrasonic joining using vibration parallel to joining surface; Ultrasonic welding

Indexed keywords

ALUMINUM; CERAMIC MATERIALS; COPPER; HEAT RESISTANCE; JOINING; MELTING; NICKEL; ULTRASONIC WELDING; VIBRATIONS (MECHANICAL);

CERAMIC PLATES; ULTRASONIC JOINING;

SILICON NITRIDE;

EID: 0033330559     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.38.6166     Document Type: Article

References (7)

1. Y. Muto: J. Adhes. Soc. Jpn. 32 (1996) 416 [in Japanese].
2. S. Matsuoka: J. Jpn. Soc. Mcch. Eng. C 55 (1989) 2481 [in Japanese].
3. S. Matsuoka: J. Jpn. Soc. Tcchnol. Plast. 28 (1987) 1186 [in Japanese].
4. T. Suga, S. Matsuoka, K. Miyazawa and T. Fujii: Proc. Autumn Meet. Jpn. Inst. Mcl. (1988) p. 350 [in Japanese].
5. N. Okamura and Y. Watanabc: Proc. Autumn Meet. Acoust. Soc. Jpn. (1998) p. 1115 [in Japanese].
6. Y. Watanabc and E. Mori: Jpn. J. Appl. Phys. 35 (1996) 3263.
7. N. Okamura and Y. Watanabe: Proc. 1997 World Congr. Ultrasonics (1997) p. 150.