Dynamic strain and chip damage during ultrasonic flip chip bonding

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 40, Issue 4 B, 2001, Pages 3044-3048

  Hizukuri, M ^a   Watanabe, N ^a   Asano, T ^a  

^a KYUSHU INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

Bonding damage; Flip chip bonding; Strain gauge; Ultrasonic; Wire bonding

Indexed keywords

CHIP SCALE PACKAGES; DELAMINATION; STRAIN GAGES; ULTRASONIC APPLICATIONS;

DYNAMIC STRAINS; ULTRASONIC FLIP CHIP BONDING;

FLIP CHIP DEVICES;

EID: 0035300808     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.40.3044     Document Type: Article

References (3)