16 × 16 VCSEL array flip-chip bonded to CMOS VLSI circuit

IEEE Photonics Technology Letters

Volumn 12, Issue 8, 2000, Pages 1073-1075

  Krishnamoorthy, A V ^a   Goossen, K W ^a   Chirovsky, L M F ^a   Rozier, R G ^a   Chandramani, P ^a   Hobson, W S ^a   Hui, S P ^a   Lopata, J ^a   Walker, J A ^a   D'asaro L A ^a  

^a LUCENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BANDWIDTH; CMOS INTEGRATED CIRCUITS; CROSSTALK; ELECTRIC IMPEDANCE; FLIP CHIP DEVICES; INTERFERENCE SUPPRESSION; MODULATION; QUANTUM WELL LASERS; SEMICONDUCTING SILICON; SEMICONDUCTOR DEVICE TESTING; VLSI CIRCUITS;

CROSSTALK SUPPRESSION; FLIP CHIP BONDING; OPTICAL ARRAYS; THERMAL IMPEDANCE; VERTICAL CAVITY SURFACE EMITTING LASERS;

SEMICONDUCTOR LASERS;

EID: 0343878169     PISSN: 10411135     EISSN: None     Source Type: Journal    
DOI: 10.1109/68.868012     Document Type: Article

References (6)

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2. 2-VCSEL's)," IEEE Photon. Technol. Lett., vol. 11, pp. 500-502, 1999.
3. K. W. Goossen and A. V. Krishnamoorthy, "Optoelectronics-in-VLSI technology," in Encyclopedia of Electrical & Electronics Engineering, J. G. Webster, Ed. New York: Wiley, 1999.
4. A. R. Tanguay, Jr., private communication.
5. R. Pu, C. W. Wilmsen, K. M. Geib, and K. D. Choquette, "Thermal resistance of VCSEL's bonded to integrated circuits," IEEE Photon. Technol. Lett., vol. 11, pp. 1554-1556, 1999.
6. D. L. Mathine, H. Nejad, D. R. Allee, R. Droopad, and G. N. Maracas, "Reduction of thermal impedance of VCSEL's after integration with copper substrates," Appl. Phys. Lett., vol. 69, pp. 463-464, 1996.