-
2
-
-
17644439354
-
-
0163-1918.
-
Y. N. Hwang, S. H. Lee, S. J. Ahn, S. Y. Lee, K. C. Ryoo, H. S. Hong, H. C. Koo, F. Yeung, J. H. Oh, H. J. Kim, Tech. Dig.-Int. Electron Devices Meet. 0163-1918, 2003, 893.
-
Tech. Dig. - Int. Electron Devices Meet.
, vol.2003
, pp. 893
-
-
Hwang, Y.N.1
Lee, S.H.2
Ahn, S.J.3
Lee, S.Y.4
Ryoo, K.C.5
Hong, H.S.6
Koo, H.C.7
Yeung, F.8
Oh, J.H.9
Kim, H.J.10
-
3
-
-
65949115481
-
-
in, Vol..
-
D. -H. Kang, J. -H. Lee, J. H. Kong, D. Ha, J. Yu, C. Y. Um, J. H. Park, F. Yeung, J. H. Kim, W. I. Park, in 1998 Symposium on VLSI Technology Digest of Technical Papers, Vol. 98, 2008.
-
(2008)
1998 Symposium on VLSI Technology Digest of Technical Papers
, vol.98
-
-
Kang, D.-H.1
Lee, J.-H.2
Kong, J.H.3
Ha, D.4
Yu, J.5
Um, C.Y.6
Park, J.H.7
Yeung, F.8
Kim, J.H.9
Park, W.I.10
-
4
-
-
58149231291
-
-
0018-9200,. 10.1109/JSSC.2008.2006439
-
F. Bedeschi, R. Fackenthal, C. Resta, E. M. Donz̀, M. Jagasivamani, E. C. Buda, F. Pellizzer, D. W. Chow, A. Cabrini, G. M. A. Calvi, IEEE J. Solid-State Circuits 0018-9200, 44, 217 (2009). 10.1109/JSSC.2008.2006439
-
(2009)
IEEE J. Solid-State Circuits
, vol.44
, pp. 217
-
-
Bedeschi, F.1
Fackenthal, R.2
Resta, C.3
Donz̀, E.M.4
Jagasivamani, M.5
Buda, E.C.6
Pellizzer, F.7
Chow, D.W.8
Cabrini, A.9
Calvi, G.M.A.10
-
5
-
-
0010435198
-
-
0040-6031,. 10.1016/0040-6031(86)85051-1
-
S. Bordas, M. T. Clavaguera-Mora, B. Legendre, and C. Hancheng, Thermochim. Acta 0040-6031, 107, 239 (1986). 10.1016/0040-6031(86)85051-1
-
(1986)
Thermochim. Acta
, vol.107
, pp. 239
-
-
Bordas, S.1
Clavaguera-Mora, M.T.2
Legendre, B.3
Hancheng, C.4
-
6
-
-
16244410161
-
-
1476-1122,. 10.1038/nmat1350
-
M. H. R. Lankhorst, B. W. S. M. M. Ketelaars, and R. A. M. Wolters, Nature Mater. 1476-1122, 4, 347 (2005). 10.1038/nmat1350
-
(2005)
Nature Mater.
, vol.4
, pp. 347
-
-
Lankhorst, M.H.R.1
Ketelaars, B.W.S.M.M.2
Wolters, R.A.M.3
-
7
-
-
45849147380
-
-
0003-6951,. 10.1063/1.2945284
-
S. Lee, J.-h. Jeong, T. S. Lee, W. M. Kim, and B. Cheong, Appl. Phys. Lett. 0003-6951, 92, 243507 (2008). 10.1063/1.2945284
-
(2008)
Appl. Phys. Lett.
, vol.92
, pp. 243507
-
-
Lee, S.1
Lee, T.S.2
Kim, W.M.3
Cheong, B.4
-
8
-
-
63649143924
-
-
0022-3727,. 10.1088/0022-3727/42/3/035104
-
J.-h. Jeong, H. S. Lee, S. Lee, T. S. Lee, W. M. Kim, W. Zhe, S. C. Kim, K. H. Oh, and B. Cheong, J. Phys. D 0022-3727, 42, 035104 (2009). 10.1088/0022-3727/42/3/035104
-
(2009)
J. Phys. D
, vol.42
, pp. 035104
-
-
Lee, H.S.1
Lee, S.2
Lee, T.S.3
Kim, W.M.4
Zhe, W.5
Kim, S.C.6
Oh, K.H.7
Cheong, B.8
-
9
-
-
0038060332
-
-
0021-4922,. 10.1143/JJAP.42.863
-
M. H. R. Lankhorst, L. van Pieterson, M. van Schijndel, B. A. J. Jacobs, and J. C. N. Rijpers, Jpn. J. Appl. Phys., Part 1 0021-4922, 42, 863 (2003). 10.1143/JJAP.42.863
-
(2003)
Jpn. J. Appl. Phys., Part 1
, vol.42
, pp. 863
-
-
Lankhorst, M.H.R.1
Van Pieterson, L.2
Van Schijndel, M.3
Jacobs, B.A.J.4
Rijpers, J.C.N.5
-
10
-
-
65949123756
-
-
B. Cheong, I. H. Kim, H. Jung, T. S. Lee, J. -h. Jeong, D. -H. Kang, W. M. Kim, and J. -G. Ha, Electronic Materials Letters, 2, 43 (2006).
-
(2006)
Electronic Materials Letters
, vol.2
, pp. 43
-
-
Cheong, B.1
Kim, I.H.2
Jung, H.3
Lee, T.S.4
Kang, D.-H.5
Kim, W.M.6
Ha, J.-G.7
-
11
-
-
0019026872
-
-
0021-8979,. 10.1063/1.328036
-
D. Adler, M. S. Shur, M. Silver, and S. R. Ovshinsky, J. Appl. Phys. 0021-8979, 51, 3289 (1980). 10.1063/1.328036
-
(1980)
J. Appl. Phys.
, vol.51
, pp. 3289
-
-
Adler, D.1
Shur, M.S.2
Silver, M.3
Ovshinsky, S.R.4
-
12
-
-
18844384191
-
-
0021-8979,. 10.1063/1.1884248
-
B. -S. Lee, J. R. Abelson, S. G. Bishop, D. -H. Kang, B. Cheong, and K. -B. Kim, J. Appl. Phys. 0021-8979, 97, 093509 (2005). 10.1063/1.1884248
-
(2005)
J. Appl. Phys.
, vol.97
, pp. 093509
-
-
Lee, B.-S.1
Abelson, J.R.2
Bishop, S.G.3
Kang, D.-H.4
Cheong, B.5
Kim, K.-B.6
-
13
-
-
31544440445
-
-
0021-4922,. 10.1143/JJAP.44.7340
-
T. Kato and K. Tanaka, Jpn. J. Appl. Phys., Part 1 0021-4922, 44, 7340 (2005). 10.1143/JJAP.44.7340
-
(2005)
Jpn. J. Appl. Phys., Part 1
, vol.44
, pp. 7340
-
-
Kato, T.1
Tanaka, K.2
-
14
-
-
33646891102
-
-
0021-4922,. 10.1143/JJAP.45.3955
-
X. S. Miao, L. P. Shi, H. K. Lee, J. M. Li, R. Zhao, P. K. Tan, K. G. Lim, H. X. Yang, and T. C. Chong, Jpn. J. Appl. Phys., Part 1 0021-4922, 45, 3955 (2006). 10.1143/JJAP.45.3955
-
(2006)
Jpn. J. Appl. Phys., Part 1
, vol.45
, pp. 3955
-
-
Miao, X.S.1
Shi, L.P.2
Lee, H.K.3
Li, J.M.4
Zhao, R.5
Tan, P.K.6
Lim, K.G.7
Yang, H.X.8
Chong, T.C.9
-
15
-
-
21444433964
-
-
0021-8979,. 10.1063/1.1868860
-
L. van Pieterson, M. H. R. Lankhorst, M. van Schijndel, A. E. T. Kuiper, and J. H. J. Roosen, J. Appl. Phys. 0021-8979, 97, 083520 (2005). 10.1063/1.1868860
-
(2005)
J. Appl. Phys.
, vol.97
, pp. 083520
-
-
Van Pieterson, L.1
Lankhorst, M.H.R.2
Van Schijndel, M.3
Kuiper, A.E.T.4
Roosen, J.H.J.5
-
16
-
-
35949040018
-
-
0034-6861,. 10.1103/RevModPhys.50.209
-
D. Adler, H. K. Henisch, and N. F. Mott, Rev. Mod. Phys. 0034-6861, 50, 209 (1978). 10.1103/RevModPhys.50.209
-
(1978)
Rev. Mod. Phys.
, vol.50
, pp. 209
-
-
Adler, D.1
Henisch, H.K.2
Mott, N.F.3
-
17
-
-
11144230051
-
-
1530-4388,. 10.1109/TDMR.2004.836724
-
A. Pirovano, A. Redaelli, F. Pellizzer, F. Ottogalli, M. Tosi, D. Ielmini, A. L. Lacaita, and R. Bez, IEEE Trans. Device Mater. Reliab. 1530-4388, 4, 422 (2004). 10.1109/TDMR.2004.836724
-
(2004)
IEEE Trans. Device Mater. Reliab.
, vol.4
, pp. 422
-
-
Pirovano, A.1
Redaelli, A.2
Pellizzer, F.3
Ottogalli, F.4
Tosi, M.5
Ielmini, D.6
Lacaita, A.L.7
Bez, R.8
-
18
-
-
0035886318
-
-
0021-8979,. 10.1063/1.1405141
-
W. K. Njoroge and M. Wuttig, J. Appl. Phys. 0021-8979, 90, 3816 (2001). 10.1063/1.1405141
-
(2001)
J. Appl. Phys.
, vol.90
, pp. 3816
-
-
Njoroge, W.K.1
Wuttig, M.2
|