Improvement in the oxidation resistance of Cu films by an electroless Co-alloy capping process

Journal of the Electrochemical Society

Volumn 156, Issue 7, 2009, Pages

  Koo, Hyo Chol ^a   Cho, Sung Ki ^a   Kwon, Oh Joong ^b   Suh, Myung Won ^c   Im, Young ^c   Kim, Jae Jeong ^a  

^a Seoul National University   (South Korea)

^b SolarLight Ltd   (South Korea)

^c KC Tech   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ALLOY FILM; BEFORE AND AFTER; CAPPING PROCESS; CHEMICAL STATE; CU DIFFUSION; CU FILMS; DEPTH PROFILE; ELECTROLESS; ELECTROLESS TECHNIQUE; FILM COMPOSITION; MULTILAYER STRUCTURES; OXIDATION BARRIER; SOLUTION COMPOSITION;

CHEMICAL ANALYSIS; COBALT; COPPER ALLOYS; LITHIUM BATTERIES; METALLIC FILMS; OXIDATION; OXIDATION RESISTANCE; PALLADIUM; SURFACE DIFFUSION; SURFACE STRUCTURE;

COPPER;

EID: 65949084245     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3133219     Document Type: Article

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