Oxidation resistive Cu films by room temperature surface passivation with thin Ag layer

Electrochemical and Solid-State Letters

Volumn 6, Issue 2, 2003, Pages

  Kim, Jae Jeong ^a   Kim, Yong Shik ^a   Kim, Soo Kil ^a  

^a Seoul National University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; DIFFUSION; ELECTRODEPOSITION; GRAIN BOUNDARIES; OXIDATION RESISTANCE; OXYGEN; PASSIVATION; SCANNING ELECTRON MICROSCOPY; SILVER; SURFACES; THIN FILMS; X RAY DIFFRACTION ANALYSIS;

DAMASCENCE COPPER STRUCTURE; GALVANIC DISPLACEMENT DEPOSITION METHOD; OXIDATION RESISTIVE COPPER FILMS;

COPPER;

EID: 0037323284     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1534732     Document Type: Article

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