Improving yield through the application of process window OPC

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 7274, Issue , 2009, Pages

  Azpiroz, Jaione Tirapu ^a   Krasnoperova, Azalia ^a   Siddiqui, Shahab ^a   Settlemyer, Kenneth ^a   Graur, Ioana ^a   Stobert, Ian ^a   Oberschmidt, James M ^a  

^a IBM MICROELECTRONICS   (United States)

Author keywords

65nm; Contact; PWOPC; Yield

Indexed keywords

65NM; CATASTROPHIC FAILURES; CONTACT; CONTACT LEVELS; ERROR BUDGETS; MANUFACTURING SOLUTIONS; OPC ALGORITHMS; OPTICAL PROXIMITY CORRECTIONS; OVERLAY TOLERANCES; PROCESS VARIABILITY; PROCESS VARIATION; PROCESS WINDOW; PWOPC; ROBUST SOLUTIONS; SINGLE PROCESS; SYSTEMATIC VARIATION; TECHNOLOGY NODES; VERIFICATION ALGORITHMS; VERIFICATION METHOD; YIELD; YIELD ENHANCEMENT;

RANKINE CYCLE; WINDOWS;

LITHOGRAPHY;

EID: 65849358899     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.811868     Document Type: Conference Paper

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