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Volumn 7273, Issue , 2009, Pages

Engine for characterization of defects, overlay and critical dimension control for double exposure processes for advanced logic nodes

Author keywords

Detectivity; Double patterning; Overlay; Pitch split

Indexed keywords

ALTERNATIVE METHODS; CRITICAL DIMENSION CONTROL; DEFECTIVITY; DETECTIVITY; DOUBLE EXPOSURE; DOUBLE PATTERNING; LITHOGRAPHIC DIMENSIONS; LOGIC NODES; NUMERICAL APERTURE; OVERLAY; PATTERN DENSITY; PATTERNING TECHNIQUES; PITCH-SPLIT; RESIST SYSTEMS;

EID: 65849160645     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.828483     Document Type: Conference Paper
Times cited : (11)

References (14)
  • 1
    • 44949233070 scopus 로고    scopus 로고
    • Topological and model based approach to pitch decomposition for double patterning
    • P. Nikolsky, N. Davydova, R. Goosens, Topological and Model Based approach to pitch decomposition for double patterning, Proc. of SPIE 6792, 679205 (2008).
    • (2008) Proc. of SPIE , vol.6792 , pp. 679205
    • Nikolsky, P.1    Davydova, N.2    Goosens, R.3
  • 2
    • 35148893585 scopus 로고    scopus 로고
    • Enabling immersion lithography and double patterning
    • K. Monahan, A. Widmann, Enabling Immersion Lithography and Double Patterning, Proc. of SPIE, 6518, 6518IM (2007).
    • (2007) Proc. of SPIE , vol.6518
    • Monahan, K.1    Widmann, A.2
  • 6
    • 62449275799 scopus 로고    scopus 로고
    • Using scatterometry to improve process control during the spacer pitch-splitting process
    • S. Corboy, C. MacNaughton, T. Gubiotti, M. Wollenweber, Using Scatterometry to improve process control during the spacer pitch-splitting process, Proc. of SPIE 7140, 714025 (2008).
    • (2008) Proc. of SPIE , vol.7140 , pp. 714025
    • Corboy, S.1    MacNaughton, C.2    Gubiotti, T.3    Wollenweber, M.4
  • 8
    • 35148837660 scopus 로고    scopus 로고
    • Manufacturability issues with double patterning for 50 nm Half-pitch single damascene applications, using RELACS Shrink and corresponding OPC
    • M. O. Beeck, J. Versluijs, V. Wiaux, T. Vanderweyer, I. Ciofi, H. Struyf, D. Hendrckx, J. V. Olmen, Manufacturability issues with double patterning for 50 nm Half-pitch single damascene applications, using RELACS Shrink and corresponding OPC, Proc. of SPIE 6520, 652001 (2007).
    • (2007) Proc. of SPIE , vol.6520 , pp. 652001
    • Beeck, M.O.1    Versluijs, J.2    Wiaux, V.3    Vanderweyer, T.4    Ciofi, I.5    Struyf, H.6    Hendrckx, D.7    Olmen, J.V.8
  • 10
    • 35148897294 scopus 로고    scopus 로고
    • Ultra-low kl oxide contact hole formation and metal filling using resist contact hole pattern by double L&S formation method
    • H. Nakamura, M. Omura, S. Yamashita, Y. Taniguchi, J. Abe, S. Tanaka, S. Innoue, Ultra-low kl oxide contact hole formation and metal filling using resist contact hole pattern by double L&S formation method, Proc. of SPIE, 6520, 65201E (2007).
    • (2007) Proc. of SPIE , vol.6520
    • Nakamura, H.1    Omura, M.2    Yamashita, S.3    Taniguchi, Y.4    Abe, J.5    Tanaka, S.6    Innoue, S.7
  • 12
    • 34648862054 scopus 로고    scopus 로고
    • A litho-only approach to double patterning
    • A. Vanleenhove, D. V. Steenwinckel, A litho-only approach to double patterning, Proc. of SPIE 6520, 65202F (2007).
    • (2007) Proc. of SPIE , vol.6520
    • Vanleenhove, A.1    Steenwinckel, D.V.2
  • 14
    • 62449201555 scopus 로고    scopus 로고
    • Full-chip pitch/pattern splitting for lithography and spacer double patterning techniques
    • T-B Chiou, R. Socha, H-Y Kang, A. C Chen, S. Hsu, Full-chip pitch/pattern splitting for lithography and spacer double patterning techniques, Proc. SPIE 71401Z (2008).
    • (2008) Proc. SPIE
    • Chiou, T.-B.1    Socha, R.2    Kang, H.-Y.3    Chen, A.C.4    Hsu, S.5


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.