Full-chip pitch/pattern splitting for lithography and spacer double patterning technologies

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 7140, Issue , 2008, Pages

  Chiou, Tsann Bim ^a   Socha, Robert ^b   Kang, Ho Young ^c   Chen, Alek C ^a   Hsu, Stephen ^b   Chen, Hong ^b   Chen, Luoqi ^b  

^a ASML Taiwan Ltd   (Taiwan)

^b ASML US Inc   (United States)

^c ASML   (Netherlands)

Author keywords

Color conflict; Design for manufacturing (DFM); Double patterning technology (DPT); Pattern splitting; Rule based coloring; Spacer; Stitching boundary correction

Indexed keywords

DESIGN FOR MANUFACTURING (DFM); DOUBLE PATTERNING TECHNOLOGY (DPT); PATTERN SPLITTING; RULE-BASED COLORING; SPACER; STITCHING BOUNDARY CORRECTION;

COLORING; COMPUTER AIDED DESIGN; EXTREME ULTRAVIOLET LITHOGRAPHY; LIGHT; LIGHT SOURCES; LITHOGRAPHY; NANOTECHNOLOGY; SCANNING; TECHNOLOGY; ULTRAVIOLET DEVICES;

TITRATION;

EID: 62449201555     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.804763     Document Type: Conference Paper

References (9)

1. J. Mulkens, et. al., "Latest developments on immersion exposure systems," SPIE Optical Mierolithography XXI, v6924, (2008).
2. M. van de Kerkhof, et. al., "Imaging Performance Optimization for Hyper-NA Scanner Systems in high-volume production," SPIE Optical Mierolithography XXI, v6924, (2008).
3. J. Mulkens, et. al., "Defects, overlay, and focus performance improvements with five generations of immersion exposure systems," SPIE Optical Mierolithography XX, v6520, (2007).
4. M. Dusa, et. al., "Pitch doubling through dual-patterning lithography challenges in integration and litho budgets," SPIE Optical Mierolithography XX, v6520, (2007).
5. C. M. Lim, et. al., "Positive and negative tone double patterning lithography for 50nm flash memory," SPIE Optical Mierolithography XIX, v6154, (2006).
6. J. C. Park, et. al., "Application challenges with double patterning technology (DPT) beyond 45nm," SPIE Photomask Technology, v6349, (2006).
7. A. M. Biswas, et. al., "Extension of 193 nm dry lithography to 45-nm half-pitch node: double exposure and double processing technique," SPIE Photomask Technology, v6349, (2006).
8. A. B. van Oosten, et. al., "Pattern split rules! A feasibility study of rule based pitch decomposition for double patterning," SPIE Photomask Technology, v6730, (2007).
9. M. C. Smayling, H. Y. Liu, and L. Caib, "Low k1 logic design using gridded design rules," SPIE Advanced Lithography, v6925, (2007).