Enabling immersion lithography and double patterning

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6518, Issue PART 1, 2007, Pages

  Monahan, Kevin M ^a   Widmann, Amir ^b  

^a Quantitative Yield Strategies   (United States)

^b KLA TENCOR CORPORATION   (United States)

Author keywords

Advanced process control; Design for manufacturability; Double patterning; Immersion lithography; Line end shortening; Overlay metrology; Pitch splitting; Scatterometry

Indexed keywords

ADVANCED PROCESS CONTROL (APC); DESIGN FOR MANUFACTURABILITY (DFM); DOUBLE PATTERNING LITHOGRAPHY (DPL); OVERLAY METROLOGY;

DATA ACQUISITION; ETCHING; MEASUREMENT THEORY; PROCESS CONTROL; SEMICONDUCTOR MATERIALS;

LITHOGRAPHY;

EID: 35148893585     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.714204     Document Type: Conference Paper

References (5)

1. K. Monahan and U. Whitney, "Enabling DFM and APC strategies with advanced process metrics", Proceedings of SPIE, vol. 6152, 2006, and references therein.
2. K. Hung, et al., "Scatterometry measurements of line end shortening structures for focus-exposure monitoring", Proceedings of SPIE, vol. 6152, 2006.
3. Ryan Chia-Jen Chen, et al., "Application of spectroscopic ellipsometry for ultra thin spacer structure", Proceedings of SPIE, vol. 5375, pp 1381-1374, 2005.
4. V. Vachellerie, "Gate spacer width monitoring study with scatterometry based on spectroscopic ellipsometry", in Characterization and Metrology for ULSI Technology 2005, pp. 411-420.
5. M. Wang, et al., "Metal layer monitoring in DRAM production by the use of spectroscopic ellipsometry-based scatterometry," Proceedings of ASMC, 2006.