Multiprincipal-element AlCrTaTiZr-nitride nanocomposite film of extremely high thermal stability as diffusion barrier for Cu metallization

Journal of the Electrochemical Society

Volumn 156, Issue 5, 2009, Pages

  Chang, Shou Yi ^a   Chen, Ming Ku ^a   Chen, Dao Sheng ^a  

^a NATIONAL CHUNG HSING UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

AMORPHOUS SILICON; DIFFUSION BARRIERS; GRAIN BOUNDARIES; METALLIC FILMS; METALLIC MATRIX COMPOSITES; NANOCOMPOSITES; NITRIDES; SILICIDES; SILICON ALLOYS; THERMODYNAMIC STABILITY;

AMORPHOUS MATRICES; BARRIER MATERIALS; BARRIER PERFORMANCE; CU DIFFUSIONS; CU METALLIZATION; DIFFUSION RESISTANCES; DOMINANT FACTORS; EFFECTIVE DIFFUSIONS; ELECTRICAL RESISTANCES; HIGH TEMPERATURES; HIGH THERMAL STABILITIES; HIGH-ENTROPY ALLOYS; INTER DIFFUSIONS; INTERCONNECT STRUCTURES; LATTICE DISTORTIONS; MULTIPRINCIPAL ELEMENTS; NANO-COMPOSITE FILMS; NANO-COMPOSITE STRUCTURES; THERMAL STABILITIES; THERMAL-ANNEALING; THERMALLY STABLES;

COPPER;

EID: 63649149591     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3097186     Document Type: Article

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