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Volumn 41, Issue 10, 2002, Pages 6153-6164
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Transformer coupled plasma enhanced metal organic chemical vapor deposition of Ta(Si)N thin films and their Cu diffusion barrier properties
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Author keywords
CVD; Diffusion barrier; PDEAT; Plasma; Ta Si N; TaN
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Indexed keywords
COPPER;
DENSITY (SPECIFIC GRAVITY);
DIFFUSION IN SOLIDS;
DISSOCIATION;
IONIZATION;
METALLORGANIC CHEMICAL VAPOR DEPOSITION;
PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION;
TEMPERATURE;
THIN FILMS;
FILM PROPERTIES;
LANGMUIR PROBE;
OPTICAL EMISSION SPECTROSCOPY;
PENTAKISDIETHYLAMINOTANTALUM;
TANTALUM COMPOUNDS;
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EID: 0036818894
PISSN: 00214922
EISSN: None
Source Type: Journal
DOI: 10.1143/jjap.41.6153 Document Type: Article |
Times cited : (14)
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References (16)
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