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Volumn 41, Issue 10, 2002, Pages 6153-6164

Transformer coupled plasma enhanced metal organic chemical vapor deposition of Ta(Si)N thin films and their Cu diffusion barrier properties

Author keywords

CVD; Diffusion barrier; PDEAT; Plasma; Ta Si N; TaN

Indexed keywords

COPPER; DENSITY (SPECIFIC GRAVITY); DIFFUSION IN SOLIDS; DISSOCIATION; IONIZATION; METALLORGANIC CHEMICAL VAPOR DEPOSITION; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; TEMPERATURE; THIN FILMS;

EID: 0036818894     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.41.6153     Document Type: Article
Times cited : (14)

References (16)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.