Glass multilayer lamination for PCB manufacture using pressure assisted low temperature bonding

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2007, Pages 504-509

  Khoshnaw, Fuad M ^a   Conway, Paul P ^a   Hutt, David A ^a   Williams, Karen ^a  

^a LOUGHBOROUGH UNIVERSITY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ANGLE MEASUREMENT; BONDING; CHIP SCALE PACKAGES; CONTACT ANGLE; DEIONIZED WATER; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; FATIGUE TESTING; FRACTURE FIXATION; GLASS; HYDROPHILICITY; LAMINATING; MULTILAYERS; NITRIC ACID; NONMETALS; ORGANIC POLYMERS; OVENS; PHOTOMASKS; POTASSIUM; POTASSIUM HYDROXIDE; PRINTED CIRCUIT MANUFACTURE; SILICON; SOLUTIONS; STOVES; SUBSTRATES; SURFACE CHEMISTRY; SURFACE TENSION; SURFACES; TECHNOLOGY; TESTING; THERMAL EXPANSION; THERMAL SPRAYING;

A-COEFFICIENT; APPLYING PRESSURE; BONDED SHEETS; CLEANING SOLUTIONS; CONTACT-ANGLE MEASUREMENTS; CONVECTION OVEN; CYCLING TESTS; GLASS LAYERS; GLASS SHEETS; HIGH DENSITY INTERCONNECT; HIGH SURFACE ENERGY; LOW-TEMPERATURE BONDING; MULTI-LAYER STRUCTURES; MULTILAYER LAMINATION; PACKAGING TECHNOLOGIES; POTASSIUM HYDROXIDE SOLUTION; PRE TREATMENTS; SUBSTRATE MATERIALS; THIN GLASS SHEETS;

GLASS BONDING;

EID: 50049102027     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2007.4469793     Document Type: Conference Paper

References (15)

1. Meis, M. A., "Opto-Electronic Backplane Technology for Cost Effective Bandwidth Management," ECTC (2003), pp. 1073-1079.
2. Hutt, D., "Challenges in the Manufacture of Glass Substrates for Electrical and Optical Interconnect," Circuit World, Vol. 33 No. 1 (2007), pp.22-30.
3. Shelby, J. E., Introduction to Glass Science and Technology, Royal Society of Chemistry, 2005.
4. Sayah, A., "Development of Novel Low Temperature Bonding Technologies for Microchip Chemical Analysis Applications," Sensors and Actuators, Vol. 84, (2000), pp. 103-108.
5. Cao, Z., "Evaluation of Mechanical Quality of Field Assisted Diffusion Bonding by Ultrasonic Non-destructive Method," Sensors and Actuators A, Vol. 18 (2005), pp. 44-48.
6. Puers, R., "Bonding Wafers with Sodium Silicate Solution,". Micromech. Microeng., Vol. 7 (1997), pp. 114-117.
7. Takeshi I., "Water glass bonding for micro-total analysis system," Sensors and Actuators B, Vol. 81 (2002), pp. 187-195.
8. Akinobu S., "Water glass bonding," Sensors and Actuators A, Vol. 72 (1999), pp. 160-168.
9. 2 bonding with hydrofluoric acid. Room temperature and low stress bonding technique for MEMS," Sensors and Actuators, Vol. 79 (2000), pp. 237-244.
10. Zhuang, G., "A low temperature bonding of quartz microfluidic chip for serum lipoproteins analysis," Biomed. Microdevices, Vol. 8 (2006), pp. 255-261.
11. Iles, A., "Bonding of soda-lime glass microchips at low temperature," Microfluid Nanofluid, Vol. 3 (2007), pp. 119-122.
12. Jia, Z., "Bonding of glass microfluidic chips at room temperatures," Anal. Chemistry, Vol. 76 (2004), pp. 5597-5602.
13. Takeda, S., "Surface OH Group Governing Wettability of Commercial Glasses," Journal of Non-Crystalline Solids, Vol. 249 (1999), pp. 41-46.
14. Min, H., "Effects of Wafer Cleaning and Annealing on Glass/Silicon Wafer Direct Bonding," Journal of Electronic Packaging, Vol. 126 (2004), pp. 120-123.
15. Qiao, P., "Fatigue life prediction of pultraded E-glass/polyurethane composites," Journal of Composite Materials, Vol. 40, No. 9 (2006), pp. 815-837.