Epoxy-based aqueous-processable photodielectric dry film and conductive viaplug for pcb build-up and 1c packaging

IEEE Transactions on Advanced Packaging

Volumn 22, Issue 3, 1999, Pages 385-390

  Gonzalez, Ceferino G ^a  

^a Dow Chemical   (United States)

Author keywords

Dielectric; Microvias; Sequential build up (sbu); Via filling; Vialux

Indexed keywords

ELECTRONICS PACKAGING; INTEGRATED CIRCUIT MANUFACTURE; MULTICHIP MODULES; PRINTED CIRCUIT BOARDS;

PHOTODIELECTRIC DRY FILMS; SEQUENTIAL BUILD-UP (SBU);

DIELECTRIC DEVICES;

EID: 0033352025     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.784491     Document Type: Article

References (7)

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3. D. Bergman, "HDI: Where standardization is headed," in CircuitTree, Mar. 1998.
4. A. Castro, "Chip carrier package constructions made easier with dry film photo dielectric," in Proc. IPCWorks, Washington, DC, Oct. 1997, pp. S01-5-1-S01-5-7.
5. J. Thorne, "Using new interconnection technologies to reduce substrate cost," in Proc. lPCExpo'98, Long Beach, CA, Apr. 1998, session S-10.
6. H. Holden étal., IPCDesign Guide/orHDISandMicrovias(IPC-2315), Apr. 1998.
7. W. E. Estes et al., "Photodielectric dry films for ultra high density packaging," in Proc. SMI, San Jose, CA, Aug. 1997, pp. 47-53.