Large area roller embossing of multilayered ceramic green composites

DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS

Volumn , Issue , 2008, Pages 314-319

  Shan, Xuechuan ^a   Soh, Y C ^a   Shi, C W P ^a   Tay, C K ^a   Lu, C W ^a  

^a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; CHIP SCALE PACKAGES; MEMS; MICROELECTROMECHANICAL DEVICES; MOLDS; NICKEL ALLOYS; PRINTING; ROLLERS (MACHINE COMPONENTS); SUBSTRATES;

APPLIED PRESSURES; FEEDING SPEED; GREEN COMPOSITES; GREEN TAPES; LAMINATED CERAMICS; LARGE-AREA PATTERNING; M-LINES; MICRO PATTERNS; MULTI-LAYERED; NICKEL ELECTROPLATING; OPTIMIZED PROCESS; PHOTORESIST STRIPS;

CERAMIC CAPACITORS;

EID: 62249212752     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/DTIP.2008.4753009     Document Type: Conference Paper

References (12)

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