Pad characterization and experimental analysis of pad wear effect on material removal uniformity in chemical mechanical polishing

Japanese Journal of Applied Physics

Volumn 47, Issue 10 PART 1, 2008, Pages 7812-7817

  Park, Kihyun ^a   Oh, Jiheon ^a   Jeong, Haedo ^a  

^a Pusan National University   (South Korea)

Author keywords

Conditioning; Pad surface characterization; Pad wear; Within wafer nonuniformity (WIWNU)

Indexed keywords

CHEMICAL POLISHING; MATERIALS; NANOTECHNOLOGY; POLISHING; SURFACE PROPERTIES;

CONDITIONING; EXPERIMENTAL ANALYSIS; MATERIAL REMOVAL MECHANISMS; MATERIAL REMOVALS; MEASURING SYSTEMS; MECHANICAL ASPECTS; NON UNIFORMITIES; PAD CHARACTERIZATIONS; PAD CONDITIONING; PAD SURFACE CHARACTERIZATION; PAD WEAR; POLISHING PADS; WEAR EFFECTS; WITHIN WAFER NONUNIFORMITY (WIWNU);

CHEMICAL MECHANICAL POLISHING;

EID: 62249181505     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.1143/JJAP.47.7812     Document Type: Article

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