CMP pad break-in time reduction in silicon wafer polishing

CIRP Annals - Manufacturing Technology

Volumn 56, Issue 1, 2007, Pages 357-360

  Jeong, H D ^a   Park, K H ^a   Cho, K K ^a  

^a Pusan National University   (South Korea)

Author keywords

Monitoring; Polishing; Silicon

Indexed keywords

CHEMICAL MECHANICAL POLISHING; FRICTION; MONITORING; SILICON; SILICON WAFERS;

FRICTION FORCE; INFRARED SENSOR; PAD CONDITIONING; PIEZOELECTRIC FORCE SENSORS; POLISHING PARAMETERS; POLISHING PROCESSS; SURFACE CONDITIONS; WAFER POLISHING;

POLISHING;

EID: 73249128820     PISSN: 00078506     EISSN: 17260604     Source Type: Journal    
DOI: 10.1016/j.cirp.2007.05.082     Document Type: Article

References (7)

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