Oxidation and reduction behavior of pure indium

Journal of Materials Research

Volumn 24, Issue 2, 2009, Pages 386-393

  Schoeller, Harry ^a   Cho, Junghyun ^a  

^a State University of New York   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; BRAZING; INTERMETALLICS; MECHANISMS; MICROELECTROMECHANICAL DEVICES; OXIDATION; THERMODYNAMIC PROPERTIES; WELDING;

CRITICAL PARAMETERS; ELECTRON TRANSPORTS; ELLINGHAM DIAGRAMS; FLUX-LESS SOLDERING; GLOVE BOXES; GROWTH MECHANISMS; INCUBATION PERIODS; INITIAL OXIDATIONS; LOGARITHMIC LAWS; LOW TEMPERATURES; MICRO-ELECTRO MECHANICAL SYSTEMS; NANO-METER SCALE; OXIDATION AND REDUCTIONS; OXIDATION BEHAVIORS; OXIDE LAYERS; RATE-CONTROLLING MECHANISMS; REDUCING ENVIRONMENTS; SOLDER JOINT RELIABILITIES; SOLDER REFLOWS; SPECTROSCOPIC ELLIPSOMETER; THERMODYNAMIC MODELS;

INDIUM;

EID: 61749100197     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/jmr.2009.0040     Document Type: Article

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