A systematic procedure for the selection of a lead-free solder paste in an electronics manufacturing environment

Soldering and Surface Mount Technology

Volumn 17, Issue 2, 2005, Pages 32-39

  Wable, Girish S ^a   Chu, Quyen ^b   Damodaran, Purushothaman ^a   Srihari, Krishnaswami ^a  

^a State University of New York   (United States)

^b Jabil Circuit Inc   (United States)

Author keywords

Electronics industry; Joining processes; Solder

Indexed keywords

COPPER; DATA REDUCTION; ELECTRONIC EQUIPMENT; ELECTRONICS INDUSTRY; LAND FILL; PARTICLE SIZE ANALYSIS; SILVER; TIN; WETTING;

JOINING PROCESSES; LEAD-FREE SOLDER COMPOSITION; LEAD-FREE SOLDER PASTES; SOLDER;

SOLDERING ALLOYS;

EID: 21044445464     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910510597483     Document Type: Article

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