Failure analysis of In/Au solder joints

2006 7th International Conference on Electronics Packaging Technology, ICEPT '06

Volumn , Issue , 2006, Pages

  Ma, Lili ^a   Bao, Shengxiang ^a   Peng, Jing ^a   Du, Zhibo ^a  

^a UNIVERSITY OF ELECTRONIC SCIENCE AND TECHNOLOGY OF CHINA   (China)

Author keywords

Components; In Au alloy; Microstructure; Non wetting; Solder joints

Indexed keywords

FAILURE ANALYSIS; GOLD ALLOYS; INDIUM ALLOYS; MICROSTRUCTURE; MICROWAVE CIRCUITS; NITROGEN COMPOUNDS; SHEAR STRENGTH; WETTING;

DIE BONDING; DIE SHEAR STRENGTHS; GOLD LAYERS; PREVENTIVE MEASURES; SOLDER LEAD;

SOLDERED JOINTS;

EID: 35148855692     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2006.359771     Document Type: Conference Paper

References (12)

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