A fluxless flip chip bonding for VCSEL arrays using silver coated indium solder bumps

Proceedings of 2004 International IEEE Conference on the Asian Green Electronics (AGEC)

Volumn , Issue , 2004, Pages 110-116

  Chu, Kun Mo ^a   Lee, Jung Sub ^a   Cho, Han Seo ^a   Park, Hyo Hoon ^a   Jeon, Duk Young ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; FLIP CHIP DEVICES; FRACTURE; LASERS; PHOTODIODES; SEMICONDUCTING INDIUM; SOLDERING;

FLIP CHIP BONDING; SILVER COATED INDIUM SOLDER BUMPS; VERTICAL CAVITY SURFACE EMITTING LAYERS;

CHIP SCALE PACKAGES;

EID: 2342460213     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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