Indium solders

Advanced Materials and Processes

Volumn 163, Issue 4, 2005, Pages 45-47

  Humpston, Giles ^a   Jacobson, David M ^b  

^a Tessera Inc   (United States)

^b BUCKINGHAMSHIRE NEW UNIVERSITY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

CREEP; DUCTILITY; INDIUM; INDIUM ALLOYS; RECRYSTALLIZATION (METALLURGY); SOLDERED JOINTS; STRAIN; STRAIN HARDENING; STRESS ANALYSIS; STRESS RELAXATION; THERMAL CYCLING;

INDIUM LEAD ALLOYS; INDIUM SOLDERS;

SOLDERING ALLOYS;

EID: 20444398074     PISSN: 08827958     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (0)