Microstructural features and vibration fracture behavior of Sn-Zn-Ag solder alloys

Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002

Volumn , Issue , 2002, Pages 276-281

  Song, J M ^a   Lan, G F ^a   Lui, T S ^a   Chen, L H ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

DEFORMATION; FRACTURE; FRACTURE MECHANICS; LEAD-FREE SOLDERS; MICROSTRUCTURAL EVOLUTION; MODIFIED ATMOSPHERE PACKAGING; PACKAGING MATERIALS; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; TIN; ZINC;

DAMPING CAPACITY; FRACTURE BEHAVIOR; INITIAL DEFLECTION; MICROSTRUCTURAL FEATURES; VIBRATION CYCLE; VIBRATION FATIGUE; VIBRATION FORCES; VIBRATION FRACTURE RESISTANCE;

VIBRATIONS (MECHANICAL);

EID: 84966662618     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2002.1188850     Document Type: Conference Paper

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