Thin film silver deposition by electroplating for ULSI interconnect applications

Korean Journal of Chemical Engineering

Volumn 26, Issue 1, 2009, Pages 265-268

  Seo, Joon Mo ^a   Cho, Sung Ki ^a   Koo, Hyo Chol ^a   Kim, Soo Kil ^b   Kwon, Oh Joong ^c   Kim, Jae Jeong ^a  

^a Seoul National University   (South Korea)

^b Korea Institute of Science and Technology   (South Korea)

^c SolarLight Ltd   (South Korea)

Author keywords

Ag; Electroplating; ULSI interconnection

Indexed keywords

EID: 59349099822     PISSN: 02561115     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11814-009-0045-6     Document Type: Article

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