Processing and encapsulation of silver patterns by using reactive ion etch and ammonia anneal

Materials Chemistry and Physics

Volumn 66, Issue 1, 2000, Pages 77-82

  Zeng, Yuxiao ^a   Chen, Linghui ^a   Zou, Y L ^a   Nguyen, P A ^a   Hansen, J D ^a   Alford, T L ^a  

^a Arizona State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AMMONIA; ANNEALING; CRACK INITIATION; ELECTRIC CONDUCTIVITY; ELECTROMIGRATION; ION BOMBARDMENT; METALLIC FILMS; METALLIZING; PHOTORESISTORS; REACTIVE ION ETCHING; RUTHERFORD BACKSCATTERING SPECTROSCOPY; SCANNING ELECTRON MICROSCOPY;

OXYGEN PLASMAS; STRAIN INDUCED CRACKING;

SILVER METALLURGY;

EID: 0034272034     PISSN: 02540584     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0254-0584(00)00264-9     Document Type: Article

References (19)

1. Berenbaum L., Rosenberg R. Thin Solid Films. 4:1969;187.
2. Breitling H.M., Hummel R.E. J. Phys. Chem. Solids. 33:1972;845.
3. Hummel R.E., Breitling H.M. Appl. Phys. Lett. 18:1971;373.
4. Graedel T.E. J. Electrochem. Soc. 139:1992;1963.
5. Sharma S.K., Spitz J. Thin Solid Films. 65:1980;339.
6. Murarka S.P., Gutmann R.J., Kaloyeros A.E., Lanford W.A. Thin Solid Films. 236:1993;257.
7. K. Graff, in: Metal Impurities in Silicon-Device Fabrication, Springer, Berlin, 1995.
8. Murarka S.P., Hymes S.W. Crit. Rev. Solid State Mater. Sci. 20:1995;87.
9. T. Iijima, H. Ono, N. Ninomiya, Y. Ushiku, T. Hatahaka, A. Nishiyama, H. Iwai, in: Extended Abstracts of the Conference on Solid State Devices and Materials, Makuhari, 1993.
10. Alford T.L., Adams D., Laursen T., Manfred Ullrich B. Appl. Phys. Lett. 68:1996;3251.
11. Manepalli R., Stepniak F., Bidstrup S., Kohl P.A. IEEE Trans. Adv. Packaging. 22:1999;4.
12. Y.L. Zou, W. West, Y.X. Zeng, T.L. Alford, J. Vac. Sci. Technol., in press.
13. Li J., Vizkelethy G., Revesz P., Mayer J.W., Tu K.N. J. Appl. Phys. 69:1991;1020.
14. P. Singer, in: International Semiconductor, 20 November 1997.
15. Chou C.H., Philips J. J. Vac. Sci. Technol. A. 9:1991;2727.
16. Bhan M.K., Nag P.K., Miller G.P., Gregory J.C. J. Vac. Sci. Technol. A. 12:1994;699.
17. Willemsen M.F.C., Kuiper A.E.T., Reader A.H., Hokke R., Barbour J.C. J. Vac. Sci. Technol. B. 6:1988;53.
18. Ting C.Y., Wittmer M., Lyer S.S., Brodsky S.B. J. Electrochem. Soc. 131:1984;2934.
19. Y.X. Zeng, L.H. Chen, Y.L. Zou, P.A. Nyugen, J.D. Hansen, T.L. Alford, Mater. Lett., submitted for publication.