Electroplating bath control for copper interconnects

Solid State Technology

Volumn 41, Issue 11, 1998, Pages 47-57

  Taylor, Thomas ^a,c   Ritzdorf, Thomas ^a   Lindberg, Fred ^a,d   Carpenter, Brad ^a   LeFebvre, Mark ^b  

^a Semitool Incorporated   (United States)

^b SHIPLEY COMPANY   (United States)

^c Electrochemical Deposition Div S   (United States)

^d METROPOLITAN STATE UNIVERSITY OF DENVER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0002987417     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (15)

1. D. Edelstein et al., "Full Copper Wiring in a Sub-0.25 μm CMOS ULSI Technology," Proc. IEEE IEDM, pp. 773-776, 1997.
2. E.M. Zielinski et al., "Damascene Integration of Cu and Ultra-Low-k Xerogel for High-Performance Interconnects," Proc. IEEE IEDM, pp. 936-938, 1997.
3. R. Haak, C. Ogden, D. Tench, "Cyclic Voltammetric Stripping Analysis of Acid Copper Sulfate Plating Baths, Part 1: Polyether-Sulfide-Based Additives," Plat. & Surf. Fin., April 1981.
4. E.K. Yung, L.T. Romankiwand, R.C. Alkire, "Plating of Copper into Through-Holes and Vias," J. Electrochem. Soc., pp. 206-215, 136, 1, 1989.
5. T. Pearson, J.K. Dennis, "Effect of Pulsed Reverse Current on the Structure and Hardness of Copper Deposits Obtained from Acidic Electrolytes Containing Organic Additives," Surface and Coatings Tech., 42, pp. 69-79, 1990.
6. V.A. Lamb, et al., "Physical and Mechanical Properties of Electrodeposited Copper: I. Literature Survey," Plating, pp. 1289-1311, Dec. 1965.
7. H.J. Wiesner, W.P. Frey, "Some Mechanical Properties of Copper Elec-trodeposited from Pyrophosphate and Sulfate Solutions," Plat. & Surf. Fin., pp. 51-56, Feb. 1979.
8. D. Anderson, R. Haak, C. Ogden, D. Tench, J. White, "Tensile Properties of Acid Copper Electrodeposits," J. Appl. Electrochem., pp. 631-637, 13, 1985.
9. W. Freitag, et al., "Determination of the Individual Additive Components in Acid Copper Plating Baths," Plat. & Surf. Fin., Vol. 70, (10), 55, 1983.
10. P. Bratin, "New Developments in Use of CVS for Analysis of Plating Solutions," Proceedings of AES Analytical Methods Symposium, Chicago, IL, 1985.
11. K. Haak, "Ion Chromatography in the Electroplating Industry," Plat. & Surf. Fin., Sept., 1983.
12. Dahmen, p. 346.
13. R. Haak, et al., "Cyclic Voltammetric Stripping Analysis of Acid Copper Sulfate Baths, Part 1: Polyether-Sulfide-Based Additives," Plat. & Surf. Fin., April 1981.
14. R. Haak, C. Ogden, D. Tench, "Cyclic Voltammetric Stripping Analysis of Acid Copper Sulfate Baths, Part 2: Sulfoniumalkanesulfonate-Based Additives," Plat. & Surf. Fin., March 1982.
15. Qualiplate QP-4000 User's Manual, Vol. 1.4, Jan. 26, 1993.