Dynamic scaling exponents of copper electrodeposits from scanning force microscopy imaging. Influence of a thiourea additive on the kinetics of roughening and brightening

Langmuir

Volumn 14, Issue 9, 1998, Pages 2515-2524

  Mendez, S ^a,b   Andreasen, G ^a   Schilardi, P ^a   Figueroa, M ^a,b   Vazquez L ^a,c   Salvarezza, R C ^a   Arvia, A J ^a  

^a INSTITUTO DE INVESTIGACIONES FISICOQUÍMICAS TEÓRICAS Y APLICADAS INIFTA   (Argentina)

^b PONTIFICIA UNIVERSIDAD CATÓLICA DE CHILE   (Chile)

^c CSIC   (Spain)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITIVES; COPPER; CURRENT DENSITY; ELECTRIC FIELD EFFECTS; ELECTRODEPOSITION; INTERFACES (MATERIALS); MICROSCOPIC EXAMINATION; POLYCRYSTALLINE MATERIALS; SULFUR COMPOUNDS; SURFACE ROUGHNESS;

DYNAMIC SCALING THEORY; SCANNING FORCE MICROSCOPY; THIOUREA;

METALLIC FILMS;

EID: 0032045429     PISSN: 07437463     EISSN: None     Source Type: Journal    
DOI: 10.1021/la970362t     Document Type: Article

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