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Volumn 37, Issue 1, 2009, Pages 139-145

SIMS/ARXPS - A new technique of retained dopant dose and profile measurement of ultralow-energy doping processes

Author keywords

Angle resolved X ray photoelectron spectroscopy (ARXPS); Plasma doping; Plasma immersion ion implantation (PIII); Secondary ion mass spectrometry (SIMS)

Indexed keywords

CLEANING; DOPING (ADDITIVES); ELECTRON SPECTROSCOPY; HIGH PERFORMANCE LIQUID CHROMATOGRAPHY; ION BOMBARDMENT; ION IMPLANTATION; IONS; MASS SPECTROMETERS; MASS SPECTROMETRY; PHOTOELECTRICITY; PHOTOELECTRON SPECTROSCOPY; PHOTOIONIZATION; PHOTONS; PLASMA APPLICATIONS; PLASMAS; RAPID THERMAL ANNEALING; RAPID THERMAL PROCESSING; SECONDARY EMISSION; SECONDARY ION MASS SPECTROMETRY; SEMICONDUCTOR DOPING; SPECTROMETERS; SPECTROMETRY; SPECTRUM ANALYSIS; SURFACE ANALYSIS; SURFACE CLEANING;

EID: 58549113978     PISSN: 00933813     EISSN: None     Source Type: Journal    
DOI: 10.1109/TPS.2008.2006845     Document Type: Article
Times cited : (31)

References (16)
  • 1
    • 58549097207 scopus 로고    scopus 로고
    • International Technology Roadmap for Semiconductor - Front End Processes, Semicond. Ind. Assoc., San Jose, CA, 2005, p. 23. [Online]. Available: http://www.itrs.net/Links/2005ITRS/Home2005.htm
    • International Technology Roadmap for Semiconductor - Front End Processes, Semicond. Ind. Assoc., San Jose, CA, 2005, p. 23. [Online]. Available: http://www.itrs.net/Links/2005ITRS/Home2005.htm
  • 2
    • 58549116042 scopus 로고    scopus 로고
    • Plasma ion implantation hydrogenation process utilizing voltage pulse applied to substrate,
    • U.S. Patent 5 508 227, Apr. 16
    • C. Chan and S. Qin, "Plasma ion implantation hydrogenation process utilizing voltage pulse applied to substrate," U.S. Patent 5 508 227, Apr. 16, 1996.
    • (1996)
    • Chan, C.1    Qin, S.2
  • 3
    • 58549106499 scopus 로고    scopus 로고
    • Plasma immersion ion implantation process,
    • U.S. Patent 6 632 482. Oct. 14
    • T. T. Sheng, "Plasma immersion ion implantation process," U.S. Patent 6 632 482. Oct. 14, 2003.
    • (2003)
    • Sheng, T.T.1
  • 4
    • 0030288186 scopus 로고    scopus 로고
    • Plasma immersion ion implantation - A fledgling technique for semiconductor processing
    • P. K. Chu, S. Qin, C. Chan, N. W. Cheung, and L. A. Larson, "Plasma immersion ion implantation - A fledgling technique for semiconductor processing," Mater. Sci. Eng., R Rep., vol. R17, no. 6/7, pp. 207-280, 1996.
    • (1996) Mater. Sci. Eng., R Rep , vol.R17 , Issue.6-7 , pp. 207-280
    • Chu, P.K.1    Qin, S.2    Chan, C.3    Cheung, N.W.4    Larson, L.A.5
  • 5
    • 58549093666 scopus 로고    scopus 로고
    • M. I. Current, N. W. Cheung, S. B. Felch, B. Mizuno, C. Chan, and K. C. Walter, Plasma immersion ion implantation: Applications for semiconductor materials and coatings, in Ion Implantation Science and Technology, 2000 Edition, J. F. Ziegler, Ed. Edgewater, MD: Ion Implantation Technol. Co., 2000, pp. 133-171.
    • M. I. Current, N. W. Cheung, S. B. Felch, B. Mizuno, C. Chan, and K. C. Walter, "Plasma immersion ion implantation: Applications for semiconductor materials and coatings," in Ion Implantation Science and Technology, 2000 Edition, J. F. Ziegler, Ed. Edgewater, MD: Ion Implantation Technol. Co., 2000, pp. 133-171.
  • 7
    • 50849096717 scopus 로고    scopus 로고
    • Plasma doping on 68 nm CMOS device source/drain formations
    • Shanghai, China, May 15-16
    • S. Qin, A. McTeer, Y. J. Hu, L. J. Liu, D. Panda, and J. Trivedi, "Plasma doping on 68 nm CMOS device source/drain formations," in Proc. 8th IWJT, Shanghai, China, May 15-16, 2008, pp. 8-13.
    • (2008) Proc. 8th IWJT , pp. 8-13
    • Qin, S.1    McTeer, A.2    Hu, Y.J.3    Liu, L.J.4    Panda, D.5    Trivedi, J.6
  • 8
    • 29044439118 scopus 로고    scopus 로고
    • 6 plasma diluted with helium on plasma doping process in a pulsed glow-discharge system
    • Nov./Dec
    • 6 plasma diluted with helium on plasma doping process in a pulsed glow-discharge system," J. Vac. Sci. Technol. B, Microelectron. Process. Phenom. vol. 23, no. 6, pp. 2272-2277, Nov./Dec. 2005.
    • (2005) J. Vac. Sci. Technol. B, Microelectron. Process. Phenom , vol.23 , Issue.6 , pp. 2272-2277
    • Qin, S.1    McTeer, A.2    Hu, Y.J.3
  • 9
    • 33847368591 scopus 로고    scopus 로고
    • 6 plasma system
    • Apr
    • 6 plasma system," Surf. Coat. Technol., vol. 201, no. 15, pp. 6759-6767, Apr. 2007.
    • (2007) Surf. Coat. Technol , vol.201 , Issue.15 , pp. 6759-6767
    • Qin, S.1    McTeer, A.2
  • 10
    • 34447270796 scopus 로고    scopus 로고
    • C. W. Magee, R. S. Hockett, T. H. Büyüklimanli, I. Abdelrehim, and J. W. Marina, SIMS analyses of ultra-low-energy B ion implants in Si: Evaluation of profile shape and dose accuracy, Nucl. Instrum. Methods Phys. Res. B, Beam Interact. Mater. At., 261, no. 1/2, pp. 594-599, Aug. 2007.
    • C. W. Magee, R. S. Hockett, T. H. Büyüklimanli, I. Abdelrehim, and J. W. Marina, "SIMS analyses of ultra-low-energy B ion implants in Si: Evaluation of profile shape and dose accuracy," Nucl. Instrum. Methods Phys. Res. B, Beam Interact. Mater. At., vol. 261, no. 1/2, pp. 594-599, Aug. 2007.
  • 12
    • 0346277018 scopus 로고    scopus 로고
    • Non-destructive analysis of ultrathin dielectric films
    • Dec
    • R. Champaneria, P. Mack, R. White, and J. Wolstenholme, "Non-destructive analysis of ultrathin dielectric films," Surf. Interface Anal., vol. 35, no. 13, pp. 1028-1033, Dec. 2003.
    • (2003) Surf. Interface Anal , vol.35 , Issue.13 , pp. 1028-1033
    • Champaneria, R.1    Mack, P.2    White, R.3    Wolstenholme, J.4
  • 13
    • 0004441542 scopus 로고
    • Silicon Processing for the VLSI Era
    • Sunset, CA: Lattice Press
    • S. Wolf and R. N. Tauber, Silicon Processing for the VLSI Era, Vol. 1: Process Technology. Sunset, CA: Lattice Press, 1986, p. 213.
    • (1986) Process Technology , vol.1 , pp. 213
    • Wolf, S.1    Tauber, R.N.2
  • 14
    • 58549088253 scopus 로고    scopus 로고
    • S. Wolf and R. N. Tauber, Silicon Processing for the VLSI Era, 1: Process Technology, 1. Sunset. CA: Lattice Press, 1986, p. 228.
    • S. Wolf and R. N. Tauber, Silicon Processing for the VLSI Era, Vol. 1: Process Technology, vol. 1. Sunset. CA: Lattice Press, 1986, p. 228.
  • 15
    • 1642636654 scopus 로고
    • Redistribution of acceptor and donor impurities during thermal oxidation of silicon
    • Sep
    • A. S. Grove, O. Leistiko, and C. T. Sah, "Redistribution of acceptor and donor impurities during thermal oxidation of silicon," J. Appl. Phys., vol. 35, no. 9, pp. 2695-2701, Sep. 1964.
    • (1964) J. Appl. Phys , vol.35 , Issue.9 , pp. 2695-2701
    • Grove, A.S.1    Leistiko, O.2    Sah, C.T.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.