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Plasma immersion ion implantation - A fledgling technique for semiconductor processing
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Chu, P.K.1
Qin, S.2
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Larson, L.A.5
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41749100960
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J. F. Ziegler, Ed., Ion Implantation Science and Technology, 2000 Edition, Edgewater, MD: Ion Implantation Technol. Co., 2000, p. 133.
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3
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0028387442
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An evaluation of contamination from plasma immersion ion implantation on silicon device characteristics
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Mar
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S. Qin and C. Chan, "An evaluation of contamination from plasma immersion ion implantation on silicon device characteristics," J. Electron. Mater., vol. 23, no. 3, pp. 337-340, Mar. 1994.
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Qin, S.1
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Ultra-low cost and high performance 65 nm CMOS device fabricated with plasma doping
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Jun. 15-17
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F. Lallement, B. Duriez, A. Grouillet, F. Arnaud, B. Tavel, F. Wacquant, P. Stolk, M. Woo, Y. Erokhin, J. Scheuer, L. Godet, J. Weeman, D. Distaso, and D. Lenoble, "Ultra-low cost and high performance 65 nm CMOS device fabricated with plasma doping," in Proc. Symp. VLSI Technol. Dig. Tech. Papers, Jun. 15-17, 2004, pp. 178-179.
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Lallement, F.1
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Woo, M.8
Erokhin, Y.9
Scheuer, J.10
Godet, L.11
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Distaso, D.13
Lenoble, D.14
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5
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6 plasma doping with in-situ He pre-amorphization
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6 plasma doping with "in-situ He pre-amorphization," in Proc. Symp. VLSI Technol. Dig. Tech. Papers, Jun. 15-17, 2004, pp. 180-181.
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Sasaki, Y.1
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Higaki, R.5
Satoh, T.6
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Qin, S.1
McTeer, A.2
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7
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6 plasma diluted with helium on plasma doping process in a pulsed glow-discharge system
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Nov./Dec
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6 plasma diluted with helium on plasma doping process in a pulsed glow-discharge system," J. Vac. Sci. Technol. B, Microelectron. Process. Phenom. vol. 23, no. 6, pp. 2272-2277, Nov./Dec. 2005.
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Qin, S.1
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8
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Faraday dosimetry characteristics of PIII doping processes
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Jun
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S. Qin, M. P. Bradley, and P. L. Kellerman, "Faraday dosimetry characteristics of PIII doping processes," IEEE Trans. Plasma Sci. vol. 31, no. 3, pp. 369-376, Jun. 2003.
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Qin, S.1
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9
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34250184405
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Energy distribution of Boron Ions during plasma immersion ion implantation doping process
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Jun
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S. Qin, C. Chan, and N. McGruer, "Energy distribution of Boron Ions during plasma immersion ion implantation doping process," Plasma Source Sci. Technol., vol. 1, no. 1, pp. 1-6, Jun. 1992.
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S. K. Ghandhi, VLSI Fabrication Principles Silicon and Gallium Arsenide. New York: Wiley, 1994, p. 90.
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S. K. Ghandhi, VLSI Fabrication Principles Silicon and Gallium Arsenide. New York: Wiley, 1994, p. 90.
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11
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0003998388
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D. R. Lide, Ed, 77th Edition Boca Raton, FL: CRC Press
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D. R. Lide, Ed., CRC Handbook of Chemistry and Physics 77th Edition Boca Raton, FL: CRC Press, 1997, pp. 10-214 10-217.
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