Surface characteristics and adhesion performance of black oxide coated copper substrates with epoxy resins

Journal of Adhesion Science and Technology

Volumn 17, Issue 11, 2003, Pages 1543-1560

  Lebbai, Mohamed ^a,b   Kim, Jang Kyo ^a   Szeto, W K ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

^b QPL Ltd   (Hong Kong)

Author keywords

Black copper oxide; Bond strength; Elemental composition; Fibrillar structure; Interfacial adhesion; Plastic packages; Surface energy

Indexed keywords

ATOMIC FORCE MICROSCOPY; AUGER ELECTRON SPECTROSCOPY; BLACK COATINGS; CHEMICAL BONDS; CONTACT ANGLE; COPPER; EPOXY RESINS; INTERFACIAL ENERGY; SCANNING ELECTRON MICROSCOPY; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION; X RAY PHOTOELECTRON SPECTROSCOPY; BOND STRENGTH (MATERIALS); COPPER OXIDES; PROTECTIVE COATINGS; RESINS; SUBSTRATES; SURFACE CHEMISTRY; SURFACE ROUGHNESS;

INTERFACIAL ADHESION;

ADHESION;

BLACK COPPER; ELEMENTAL COMPOSITIONS; FIBRILLAR STRUCTURES; INTERFACIAL ADHESIONS; PLASTIC PACKAGES; SURFACE ENERGIES;

EID: 0141903355     PISSN: 01694243     EISSN: None     Source Type: Journal    
DOI: 10.1163/156856103769207392     Document Type: Article

References (30)

1. O. Yoshioka, N. Okabe, S. Nagayama and R. Yamagishi, in: Proc. 39th Electronic Components and Technology Conference, pp. 464-471 (1989).
2. H. Ohsuga, H. Suzuki, T. Aihara and T. Hamano, in: Proc. 44th Electronic Components and Technology Conference, pp. 141-146 (1994).
3. D. J. Arrowsmith, Trans. Inst. Metal Finish. 48, 88-92 (1970).
4. B. J. Love and P. F. Packman, J. Adhesion 40, 139-150 (1993).
5. H. Ishida and K. Kelley, J. Adhesion 36, 177-191 (1991).
6. S. I. Asai, T. Ando and M. Tobita, J. Adhesion Sci. Technol. 10, 1-15 (1996).
7. S. H. Ahn, H. G. Yoon and S. Y. Oh, Proc. ISHM, 7-12 (1995).
8. M. Lebbai, J. K. Kim and M. M. F. Yuen, J. Electronic Mater. 32, 564-573 (2003).
9. W. R. Meyer and G. P. Vincent, Metal Finishing 45, 61 (1947).
10. T. M. Tam and R. D. Robinson, Plating Surface Finishing 73 (4), 74-77 (1986).
11. L. J. Slomihski and A. Landau, Plating Surface Finishing 69 (6), 96-99 (1982).
12. M. Lebbai, J. K. Kim, W. K. Szeto, M. M. F. Yuen and P. Tong, J. Electronic Mater. 32, 558-563 (2003).
13. M. Lebbai, J. K. Kim and M. M. F. Yuen, J. Electronic Mater. 32, 574-582 (2003).
14. D. J. O'Connor, B. A. Sexton and R. St. C. Smart (Eds.), in: Surface Analysis Methods in Materials Science, p. 203. Springer, Berlin (1992).
15. S. G. James, A. M. Donald, I. S. Miles, L. Mallagh and W. A. MacDonald, J. Polym. Sci. Polym. Phys. Ed. 32, 221 (1993).
16. S. Wu, J. Adhesion 5, 39-55 (1973).
17. H. K. Yun, K. Cho, J. H. An and C. E. Park, J. Mater. Sci. 27, 5811-5817 (1992).
18. B. J. Love and P. F. Packman, J. Mater. Sci. 33, 1359-1367 (1998).
19. S. J. Cho, K. W. Paik and Y. G. Kim, IEEE Trans. CPMT Part B 20, 167-175 (1997).
20. T. G. Kang, I. K. Park, J. H. Kim and K. S. Choi, in: Proc. IEEE Adhesive Joining and Coating Technology in Electronic Manufacturing, Binghamton, NY, USA, pp. 106-111 (1998).
21. H. Y. Lee and J. Yu, Mater. Sci. Eng. A277, 154-160 (2000).
22. G. S. Ganesan, G. L. Lewis and H. M. Berg, in: Advances in Electronic Packaging, EEP-Vol. 10-2, T. R. Hsu and A. Bar-Cohen (Eds), pp. 717-722. ASME, NY (1995).
23. S. J. Cho and K. W. Paik, Mater. Res. Soc. Symp. Proc. 445, 275-280 (1997).
24. S. Wu, Polymer Interface and Adhesion. Marcel Dekker, New York, NY (1982).
25. J. D. Erick, R. J. Good and A. W. Neumann, J. Colloid Interface Sci. 53, 235 (1975).
26. J. F. Oliver, C. Huh and S. G. Mason, J. Adhesion 8, 223 (1977).
27. H. Y. Lee and J. Yu, J. Electronic Mater. 28, 1444-1447 (1999).
28. A. J. Kinloch, J. Mater. Sci. 15, 2141-2166 (1980).
29. J. K. Kim and Y. W. Mai, Engineered Interfaces in Fiber Reinforced Composites. Elsevier, Oxford (1998).
30. J. R. G. Evans and D. E. Packham, J. Adhesion 10, 39-47 (1979).