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Volumn 23, Issue 1, 2000, Pages 32-38

Copper lead frame: an ultimate solution to the reliability of BLP package

Author keywords

[No Author keywords available]

Indexed keywords

BOND STRENGTH (MATERIALS); COMPOSITION EFFECTS; COPPER ALLOYS; INTEGRATED CIRCUIT TESTING; OXIDES; RELIABILITY; SHEET MOLDING COMPOUNDS; SOLDERED JOINTS;

EID: 0033731389     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/6104.827524     Document Type: Article
Times cited : (18)

References (13)
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    • 1995, pp. 63-73
    • Y.-G. Kirn, T.-K. Kang, B.-S. Seol, G.-Y Cho, and K.-B. Cha, Electrical and thermal performance characterization for the bottom leaded plastic (BLP) package, in Proc. 19951EPS, 1995, pp. 63-73.
    • Proc. 19951EPS
    • Kirn, Y.-G.1    Kang, T.-K.2    Seol, B.-S.3    Cho, G.-Y.4    Cha, K.-B.5
  • 6
    • 0029218765 scopus 로고    scopus 로고
    • Investigation on the effect of copper lead frame oxidation on package delamination, in
    • 1995, pp. 463-469
    • C. T. Chong, A. Leslie, and L. T. Beng, Investigation on the effect of copper lead frame oxidation on package delamination, in Proc. 45th Electron. Conf. Technol. Conf., 1995, pp. 463-469.
    • Proc. 45th Electron. Conf. Technol. Conf.
    • Chong, C.T.1    Leslie, A.2    Beng, L.T.3
  • 7
    • 0030678345 scopus 로고    scopus 로고
    • The oxidation control of copper lead frame package for prevention of popcorn cracking, in
    • 1997, pp. 78-83
    • E. Takano, T. Mino, and K. Takahashi, The oxidation control of copper lead frame package for prevention of popcorn cracking, in Proc. 47 Electron. Comp. Technol. Conf., 1997, pp. 78-83.
    • Proc. 47 Electron. Comp. Technol. Conf.
    • Takano, E.1    Mino, T.2    Takahashi, K.3
  • 8
    • 0024914794 scopus 로고    scopus 로고
    • Improvement of moisture resistance in plastic encapsulates MOS-IC by surface finishing copper lead frame, in
    • 1989, p. 464
    • O. Yoshioka, N. Okabe, and R. Yamagishi, Improvement of moisture resistance in plastic encapsulates MOS-IC by surface finishing copper lead frame, in Proc. 39th Electron. Conf. Technol. Conf., 1989, p. 464.
    • Proc. 39th Electron. Conf. Technol. Conf.
    • Yoshioka, O.1    Okabe, N.2    Yamagishi, R.3
  • 9
    • 0029457715 scopus 로고    scopus 로고
    • A copper alloy development for lead frame, in
    • 1995, p. 433
    • Y Tomioka and J. Miyake, A copper alloy development for lead frame, in Proc. 1995 IEMT, 1995, p. 433.
    • Proc. 1995 IEMT
    • Tomioka, Y.1    Miyake, J.2
  • 10
    • 0018048437 scopus 로고    scopus 로고
    • Adhesion of polyethylene to copper: Reactions between copper oxide and the polymer
    • vol. 9, pp. 267-277, 1978
    • J. R. G. Evans and D. E. Packham, Adhesion of polyethylene to copper: Reactions between copper oxide and the polymer, J. Adhesion, vol. 9, pp. 267-277, 1978.
    • J. Adhesion
    • Evans, J.R.G.1    Packham, D.E.2
  • 13
    • 33749889741 scopus 로고    scopus 로고
    • S.-W. Ricky Lee, K.-S. Choi, and Y.-G. Kirn, Effects of package materials on the solder joint reliability of bottom-leaded plastic (BLP) package assembly, in
    • 1998, pp. 239-244
    • X. Zhang, S.-W. Ricky Lee, K.-S. Choi, and Y.-G. Kirn, Effects of package materials on the solder joint reliability of bottom-leaded plastic (BLP) package assembly, in Proc. 1998ISEPT, 1998, pp. 239-244.
    • Proc. 1998ISEPT
    • Zhang, X.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.