Kinetics of oxidation of copper alloy leadframes

Microelectronics Journal

Volumn 29, Issue 6, 1998, Pages 335-341

  Lahiri, S K ^a,d   Waalib Singh, N K ^a   Heng, K W ^a   Ang, L ^b   Goh, L C ^c  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b Schmidt Scientific Pte Ltd   (Singapore)

^c CHARTERED SEMICONDUCTOR MANUFACTURING LTD   (Singapore)

^d NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER ALLOYS; DELAMINATION; DIFFUSION; OXIDATION; OXIDES; REACTION KINETICS; SEMICONDUCTOR GROWTH; THERMAL EFFECTS; THICKNESS MEASUREMENT;

COPPER ALLOY LEADFRAME; LOGARITHMIC GROWTH LAW; OXIDE FILM;

MICROELECTRONIC PROCESSING;

EID: 0032093702     PISSN: 00262692     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2692(97)00052-9     Document Type: Article

References (9)

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