Picosecond pulsed laser ablation and micromachining of 4H-SiC wafers

Applied Surface Science

Volumn 255, Issue 8, 2009, Pages 4515-4520

  Molian, Pal ^a   Pecholt, Ben ^a   Gupta, Saurabh ^a  

^a Laboratory for Lasers   (United States)

Author keywords

Ablation; Laser; MEMS; Micromachining; Silicon carbide; Ultra short pulse

Indexed keywords

ABLATION; COMPOSITE MICROMECHANICS; COST EFFECTIVENESS; DEFECT DENSITY; DIAPHRAGMS; FIBER LASERS; LASER ABLATION; LASERS; MEMS; MICROMACHINING; MULTIPHOTON PROCESSES; PICOSECOND LASERS; PULSE REPETITION RATE; PULSED LASER APPLICATIONS; SCANNING ELECTRON MICROSCOPY; SILICON CARBIDE; SILICON WAFERS; SURFACE DEFECTS; ULTRASHORT PULSES;

ABLATION THRESHOLDS; CARBONACEOUS MATERIALS; ERBIUM DOPED FIBER LASER; FEMTOSECOND PULSED LASER; MATERIAL EXPULSION; MULTI-PHOTON ABSORPTION; SCANNING ELECTRONS; ULTRA-SHORT PULSED;

PULSED LASERS;

EID: 58349120004     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2008.11.071     Document Type: Article

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