Femtosecond-pulsed laser micromachining of a 4H-SiC wafer for MEMS pressure sensor diaphragms and via holes

Journal of Micromechanics and Microengineering

Volumn 18, Issue 3, 2008, Pages

  Dong, Yuanyuan ^a   Nair, Rajeev ^a   Molian, Raathai ^a   Molian, Pal ^a  

^a Iowa State University of Science and Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIAPHRAGMS; MEMS; MICROMACHINING; PRESSURE MEASUREMENT; PRESSURE SENSORS; SILICON CARBIDE;

PRESSURE SENSOR DIAPHRAGMS; PULSED LASER ABLATION;

ULTRASHORT PULSES;

EID: 42549100827     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/18/3/035022     Document Type: Article

References (58)