Laser micro machining of 3C-SiC single crystals

Microelectronic Engineering

Volumn 83, Issue 4-9 SPEC. ISS., 2006, Pages 1400-1402

  Zoppel, Sandra ^a,c   Farsari, Maria ^b   Merz, Robert ^c   Zehetner, Johann ^c   Stangl, Günther ^a   Reider, Georg A ^a   Fotakis, Costas ^b  

^a VIENNA UNIVERSITY OF TECHNOLOGY   (Austria)

^b INSTITUTE OF ELECTRONIC STRUCTURE AND LASER   (Greece)

^c VORARLBERG UNIVERSITY OF APPLIED SCIENCES   (Austria)

Author keywords

Excimer laser; Laser ablation; Silicon carbide; Ultrashort pulses

Indexed keywords

EXCIMER LASERS; LASER ABLATION; MICROMACHINING; PHYSICAL PROPERTIES; SILICON CARBIDE; ULTRASHORT PULSES; ULTRAVIOLET RADIATION;

ABLATED CAVITY; EXCIMER NANOSECOND LASERS; FEMTOSECOND SOLID STATE LASERS; THERMAL IMPACT;

SINGLE CRYSTALS;

EID: 33748249083     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2006.01.064     Document Type: Article

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