Effect of temperature on residual stress and mechanical properties of Ti films prepared by both ion implantation and ion beam assisted deposition

Applied Surface Science

Volumn 255, Issue 8, 2009, Pages 4484-4490

  He, Yue ^a   Zhang, Jizhong ^a,b   Yao, Wenqing ^a   Li, Dexing ^a   Teng, Xu ^a  

^a TSINGHUA UNIVERSITY   (China)

^b INTERNATIONAL CENTRE FOR MATERIALS PHYSICS   (China)

Author keywords

IBAD; MEVVA; Nanohardness; Residual stress; Titanium; XRD

Indexed keywords

ATOMIC FORCE MICROSCOPY; FILM PREPARATION; ION BEAMS; ION IMPLANTATION; IONS; MECHANICAL PROPERTIES; NANOHARDNESS; RESIDUAL STRESSES; SCANNING ELECTRON MICROSCOPY; STRESS RELAXATION; SUPERCONDUCTING FILMS; SURFACE ROUGHNESS; TEMPERATURE; THERMAL EXPANSION; TITANIUM; VACUUM APPLICATIONS; X RAY DIFFRACTION;

ANNEAL TEMPERATURES; CRITICAL TEMPERATURES; EFFECT OF TEMPERATURE; INVESTIGATE EFFECTS; MEAN SURFACE ROUGHNESS; METAL VAPOR VACUUM ARCS; MEVVA; SILICON CRYSTAL;

ION BEAM ASSISTED DEPOSITION;

EID: 58349116646     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2008.11.053     Document Type: Article

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