Internal stress and adhesion of Cu film/Si prepared by both MEVVA and IBAD

Surface and Coatings Technology

Volumn 201, Issue 3-4, 2006, Pages 1243-1249

  Yu, Miao ^a   Zhang, Jizhong ^a,b   Li, Dexing ^a   Meng, Qingli ^a   Li, Wenzhi ^a  

^a TSINGHUA UNIVERSITY   (China)

^b INTERNATIONAL CENTRE FOR MATERIALS PHYSICS   (China)

Author keywords

Adhesion; Compressive stress; Copper film; IBAD; MEVVA

Indexed keywords

ADHESION; COMPRESSIVE STRESS; ION IMPLANTATION; MORPHOLOGY; RESIDUAL STRESSES; SCANNING ELECTRON MICROSCOPY; SPUTTER DEPOSITION; X RAY DIFFRACTION ANALYSIS;

COPPER FILM; ION BEAM ASSISTANT DEPOSITION (IBAD); METAL VAPOR VACUUM ARC (MEVVA); SPUTTERING ION DENSITIES;

COPPER;

ADHESION; COMPRESSIVE STRESS; COPPER; ION IMPLANTATION; MORPHOLOGY; RESIDUAL STRESSES; SCANNING ELECTRON MICROSCOPY; SPUTTER DEPOSITION; X RAY DIFFRACTION ANALYSIS;

EID: 33748542286     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2006.01.047     Document Type: Article

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