Stress relaxation in nanoscale aluminum films

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5343, Issue , 2004, Pages 154-162

  Hyun, Seungmin ^a   Brown, Walter L ^a   Vinci, Richard P ^a  

^a Lehigh University   (United States)

Author keywords

Al thin film; Dislocation glide mechanism; Nanoscale; Stress relaxation; Time dependence

Indexed keywords

ALUMINUM; DISLOCATIONS (CRYSTALS); METALLIC FILMS; MICROELECTROMECHANICAL DEVICES; RESONANCE; STRESS RELAXATION; THERMAL CYCLING;

AL THIN FILMS; DISLOCATION GLIDE MECHANISM; FILM THICKNESS;

THIN FILMS;

EID: 2142812577     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.529632     Document Type: Conference Paper

References (11)

1. M.J. Madou, Fundamentals of Microfabrication: The Science of Miniaturization (CRC Press, 2002).
2. G.T.A Kovacs, Micromachined Transducers Sourcebook (McGraw-Hill Higher Education, 1998).
3. Krausz and K Krausz, Ch 5. The Constitutive Law of Deformation Kinetics in Unified constitutive laws of plastic deformation (Academic Press, 1996).
4. Edward W. Hart and Harvey D. Solomon, Acta Metal. 21, 295 (1973).
5. E.W. Hart, Acta Metal. 18, 599 (1970).
6. R.D. Blevins, Formulas for Natural Frequency and Mode Shape (Krieger Publishing, Malabar, FL, 1987).
7. A.J. Kalkman, A.H. Verbruggen, and S. Radelaar, J. Appl. Phys. 92, 6612 (2002).
8. A.J. Kalkman, A.H. Verbruggen, Janssen G.C.A.M., and S. Radelaar Janssen, J. Appl. Phys. 92, 4968 (2002).
9. P. Pant, K. W. Schwarz, and S. P. Baker, Acta Meter. 51, 3243 (2003).
10. H. Gao, L. Zhang, W. D. Nix, C. V. Thompson, and E. Arzt, Acta Mater. 47, 2865 (1999).
11. S. Hyun, R. P. Vinci, K. P. Fahey and B. M. Clemens, Appl. Phys. Lett. 83, 2769 (2003).