Residual stress variation in polycrystalline copper during recrystallization

Journal of Neutron Research

Volumn 12, Issue 1-3, 2004, Pages 201-205

  Wierzbanowski, K ^a   Baczmanski A ^a   Wawszczak, R ^a   Bacroix, B ^b   Lodini, A ^c  

^a AGH UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Poland)

^b CNRS   (France)

^c UNIVERSITÉ DE REIMS CHAMPAGNE ARDENNE   (France)

Author keywords

Crystallographic texture; Multireflection method; Peak width; Recrystallization; Residual stress; Stored energy

Indexed keywords

EID: 85013585193     PISSN: 10238166     EISSN: 14772655     Source Type: Journal    
DOI: 10.1080/10238160410001734685     Document Type: Article

References (11)

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