Investigation of interface properties of Ti/Ni/Ag thin films on Si substrate

Vacuum

Volumn 82, Issue 2 SPEC. ISS., 2007, Pages 162-165

  Resnik, D ^a   Kovac J ^b   Vrtacnik D ^a   Aljancic U ^a   Mozek M ^a   Zalar, A ^b   Amon, S ^a  

^a UNIVERSITY OF LJUBLJANA   (Slovenia)

^b JO EF STEFAN INSTITUTE   (Slovenia)

Author keywords

Adhesion; Ti Si interface; Ti Ni Ag multilayer structure

Indexed keywords

AUGER ELECTRON SPECTROSCOPY; ENERGY DISPERSIVE SPECTROSCOPY; INTERFACES (MATERIALS); METALLIZING; RESIDUAL STRESSES; SPUTTERING;

METAL STACK ADHESION; SPUTTERED LAYERS; TI/NI/AG MULTILAYER STRUCTURE;

THIN FILMS;

EID: 35248898009     PISSN: 0042207X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.vacuum.2007.07.034     Document Type: Article

References (5)

1. Kondo I., Yoneyama T., Kondo K., and Takenaka O. Thin Solid Films 236 (1993) 236-239
2. Yoneyama T., Kondo I., and Takenaka O. Thin Solid Films 193/194 (1990) 1056-1064
3. Felmetsger VV. Semiconductor international, October 1999.
4. KLA-Tencor Application Notes, 1996; FLX#1,8:V1,2.
5. Vogt K.W., Kohl P.A., Carter W.B., and Bottomley L.A. Surf Sci 301 (1994) 203-213