C4NP technology for lead free solder bumping

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 1320-1325

  Laine, Eric ^a   Perfecto, Eric ^b   Campbell, Barrie ^b   Wood, James ^b   Busby, James ^b   Garant, John ^b   Guerin, Luc ^c  

^a SUSS MicroTec Lithography GmbH   (United States)

^b IBM   (United States)

^c IBM CANADA LTD   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

C4NP TECHNOLOGY; GLASS MOLDS; LEAD FREE SOLDER; SOLDER BUMPING TECHNOLOGY;

ECONOMIC ANALYSIS; MACHINE DESIGN; MACHINE TOOLS; MICROFABRICATION; WAFER BONDING;

SOLDERING ALLOYS;

EID: 35348910107     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373966     Document Type: Conference Paper

References (6)

1. P.A. Gruber, et al., "Low Cost Wafer Bumping", IBM J. Res. & Dev. Vol. 49 No. 4/5, July/September 2005
2. K. Ruhmer et al., "C4NP: New Solder Bumping Technology - Low Cost and Lead Free", IMAPS Flip Chip Advanced Technology Workshop, Austin, TX, June 2005.
3. K. Ruhmer et al., "C4NP: Lead-Free and Low Cost Solder Bumping Technology for Flip Chip and WLCSP", Pan Pacific conference 2006.
4. Lee, et al., "Formation and Characterization of Cobalt-Reinforced Sn-3.5Ag Solder", 56th ECTC, San Diego, June 2006
5. De Sousa et al., "The Influence of Low Level Doping on the Thermal Evolution of SAC Alloy Solder Joints with Cu Pad Structures", 56th ECTC, San Diego, June 2006
6. th ECTC, Reno, June 2007